ATMEGA325P-20AU Atmel, ATMEGA325P-20AU Datasheet - Page 226

IC MCU AVR 32K FLASH 64-TQFP

ATMEGA325P-20AU

Manufacturer Part Number
ATMEGA325P-20AU
Description
IC MCU AVR 32K FLASH 64-TQFP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA325P-20AU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
SPI, UART/USART, USI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI, UART, USI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
54
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Package
64TQFP
Device Core
AVR
Family Name
ATmega
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Rom Size
1 KB
Height
1 mm
Length
14 mm
Supply Voltage (max)
5.5 V, 5.8 V
Supply Voltage (min)
2.4 V, 2.7 V
Width
14 mm
For Use With
ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATMEGA325P-16AU
ATMEGA325P-16AU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA325P-20AU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATMEGA325P-20AUR
Manufacturer:
Atmel
Quantity:
10 000
22.5
22.6
226
Using the Boundary-scan Chain
Using the On-chip Debug System
ATmega325P/3250P
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched
• At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift Data
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data
As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting
JTAG instruction and using Data Registers, and some JTAG instructions may select certain
functions to be performed in the Run-Test/Idle, making it unsuitable as an Idle state.
Note:
For detailed information on the JTAG specification, refer to the literature listed in
on page
A complete description of the Boundary-scan capabilities are given in the section
(JTAG) Boundary-scan” on page
As shown in
• A scan chain on the interface between the internal AVR CPU and the internal peripheral units.
• Break Point unit.
• Communication interface between the CPU and JTAG system.
All read or modify/write operations needed for implementing the Debugger are done by applying
AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/O
memory mapped location which is part of the communication interface between the CPU and the
JTAG system.
The Break Point Unit implements Break on Change of Program Flow, Single Step Break, two
Program Memory Break Points, and two combined Break Points. Together, the four Break
Points can be configured as either:
• 4 single Program Memory Break Points.
• 3 Single Program Memory Break Point + 1 single Data Memory Break Point.
• 2 single Program Memory Break Points + 2 single Data Memory Break Points.
• 2 single Program Memory Break Points + 1 Program Memory Break Point with mask (“range
• 2 single Program Memory Break Points + 1 Data Memory Break Point with mask (“range Break
onto the parallel output from the Shift Register path in the Update-IR state. The Exit-IR, Pause-
IR, and Exit2-IR states are only used for navigating the state machine.
Register – Shift-DR state. While in this state, upload the selected Data Register (selected by
the present JTAG instruction in the JTAG Instruction Register) from the TDI input at the rising
edge of TCK. In order to remain in the Shift-DR state, the TMS input must be held low during
input of all bits except the MSB. The MSB of the data is shifted in when this state is left by
setting TMS high. While the Data Register is shifted in from the TDI pin, the parallel inputs to
the Data Register captured in the Capture-DR state is shifted out on the TDO pin.
Register has a latched parallel-output, the latching takes place in the Update-DR state. The
Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine.
Break Point”).
Point”).
1. Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be
228.
entered by holding TMS high for five TCK clock periods.
Figure
22-1, the hardware support for On-chip Debugging consists mainly of
229.
”Bibliography”
8023F–AVR–07/09
”IEEE 1149.1

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