PIC16F636-I/ST Microchip Technology, PIC16F636-I/ST Datasheet - Page 153

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PIC16F636-I/ST

Manufacturer Part Number
PIC16F636-I/ST
Description
IC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F636-I/ST

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Package
14TSSOP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162057 - MPLAB ICD 2 HEADER 14DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F636-I/ST
Manufacturer:
MICROCHIP
Quantity:
1 000
Part Number:
PIC16F636-I/ST
Manufacturer:
TOS
Quantity:
941
Part Number:
PIC16F636-I/ST
Manufacturer:
MIROCHIP
Quantity:
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Part Number:
PIC16F636-I/ST
0
15.2
© 2005 Microchip Technology Inc.
DC CHARACTERISTICS
D020
D021
D022A
D022B
D023
D024
D025
Legend: TBD = To Be Determined
Note 1:
Param
No.
2:
3:
4:
† Data in ‘Typ’ column is at 5.0V, 25 C unless otherwise stated. These parameters are for design guidance
DC Characteristics: PIC12F635/PIC16F636-I (Industrial) (Continued)
I
PD
IWDT
IBOD
ILVD
ICMP
IV
IT1OSC
only and are not tested.
The test conditions for all I
wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
Front-End not included.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption. MCU only, Analog Front-End not included.
The peripheral current is the sum of the base I
peripheral is enabled. The peripheral
current from this limit. Max values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Sym
REF
Power-down Base
Current
Device Characteristics
(4)
DD
measurements in Active Operation mode are: OSC1 = external square
PIC12F635/PIC16F636/639
Preliminary
current can be determined by subtracting the base I
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
DD
or I
Typ†
TBD
TBD
TBD
0.99
11.5
109
138
1.2
2.9
0.3
1.8
8.4
3.3
6.1
4.0
4.6
6.0
58
58
85
PD
DD
and the additional current consumed when this
; MCLR = V
Max
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Units
nA
nA
nA
DD
-40°C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
; WDT disabled. MCU only, Analog
V
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
T
DD
A
+85°C for industrial
WDT, BOD,
Comparators, V
and T1OSC disabled
WDT Current
BOD Current
PLVD Current
Comparator Current
CV
T1OSC Current
Conditions
REF
DS41232B-page 151
Current
DD
Note
DD
or I
.
(3)
(3)
(3)
PD
REF
(3)
(3)

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