PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 220
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 220 of 234
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
14-Lead Plastic Small Outline (SL or OD) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS41232D-page 218
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
N
A
E
D
α
e
h
L
φ
c
b
β
A2
E
1.25
0.10
0.25
0.40
0.17
0.31
MIN
φ
0°
5°
5°
–
L
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
© 2007 Microchip Technology Inc.
MAX
β
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
α
c
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