PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 181
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 181 of 234
- Download datasheet (4Mb)
15.10 AC Characteristics: PIC12F635/PIC16F636/639 (Industrial, Extended)
FIGURE 15-5:
TABLE 15-1:
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
OS01
OS02
OS03
OS04*
OS05*
Note 1:
Param
(LP, XT, HS Modes)
No.
OSC2/CLKOUT
OSC2/CLKOUT
(CLKOUT Mode)
OSC1/CLKIN
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
F
T
T
TosH,
TosL
TosR,
TosF
OSC
CY
Sym
OSC
These parameters are characterized but not tested.
are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for
all devices.
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN High,
External CLKIN Low
External CLKIN Rise,
External CLKIN Fall
CLOCK OSCILLATOR TIMING REQUIREMENTS
CLOCK TIMING
Characteristic
Q4
-40°C
(1)
CY
T
(1)
) equals four times the input oscillator time base period. All specified values are
A
(1)
(1)
OS02
+125°C
Q1
(1)
PIC12F635/PIC16F636/639
Min
250
250
250
200
100
DC
DC
DC
DC
DC
0.1
27
50
50
50
20
—
—
1
2
0
0
0
Q2
32.768
Typ†
30.5
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CY
OS03
10,000
OS04
1,000
Max
DC
37
20
20
20
50
25
15
—
—
—
—
—
—
4
4
4
Q3
OS04
Units
MHz
MHz
MHz
MHz
MHz
MHz
kHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
s
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
EC Oscillator mode
LP Oscillator mode
XT Oscillator mode
HS Oscillator mode
RC Oscillator mode
T
LP oscillator
XT oscillator
HS oscillator
LP oscillator
XT oscillator
HS oscillator
CY
Q4
= 4/F
OSC
Conditions
DS41232D-page 179
Q1
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