PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 182
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 182 of 234
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
TABLE 15-2:
DS41232D-page 180
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS06
OS07
OS08
OS09*
OS10*
Note 1:
Param
No.
2:
3:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
T
T
HF
LF
T
These parameters are characterized but not tested.
and are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
To ensure these oscillator frequency tolerances, V
device as possible. 0.1 F and 0.01 F values in parallel are recommended.
By design.
SC
WARM
IOSCST
Sym
OSC
OSC
OSCILLATOR PARAMETERS
Internal Oscillator Switch
when running
Fail-Safe Sample Clock
Period
Internal Calibrated
HFINTOSC Frequency
Internal Uncalibrated
LFINTOSC Frequency
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
Characteristic
(1)
-40°C
(3)
T
CY
A
) equals four times the input oscillator time base period. All specified values are
+125°C
(2)
Tolerance
Freq
—
—
1%
2%
5%
—
—
—
—
DD
7.92
7.84
7.60
Min
5.5
3.5
15
—
—
3
and V
Typ†
SS
8.0
8.0
8.0
—
21
31
12
7
6
must be capacitively decoupled as close to the
Max
8.08
8.16
8.40
45
24
14
—
11
2
Units
T
MHz
MHz
MHz
kHz
ms
OSC
s
s
s
© 2007 Microchip Technology Inc.
Slowest clock
LFINTOSC/64
V
2.5V
0°C
2.0V
-40°C
-40°C
V
V
V
DD
DD
DD
DD
= 3.5V, 25°C
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
T
V
V
A
Conditions
T
T
DD
DD
A
A
+85°C
+85°C (Ind.),
+125°C (Ext.)
5.5V,
5.5V,
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