PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 148
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 148 of 234
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
FIGURE 12-10:
12.13 Code Protection
If
programmed, the on-chip program memory can be
read out using ICSP for verification purposes.
DS41232D-page 146
(INTCON<1>)
(INTCON<7>)
Note:
INSTRUCTION FLOW
the
CLKOUT
Note 1:
Instruction
Instruction
INTF Flag
Executed
Fetched
INT pin
GIE bit
OSC1
code
2:
3:
4:
PC
(4)
The entire data EEPROM and Flash pro-
gram memory will be erased when the
code protection is turned off. See the
“PIC12F6XX/16F6XX Memory Program-
ming Specification” (DS41204) for more
information.
XT, HS or LP Oscillator mode assumed.
T
GIE = 1 assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = 0, execution will continue in-line.
CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
OST
Inst(PC) = Sleep
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
protection
Inst(PC – 1)
= 1024 T
PC
WAKE-UP FROM SLEEP THROUGH INTERRUPT
OSC
(drawing not to scale). This delay does not apply to EC and RC Oscillator modes.
bit(s)
Inst(PC + 1)
PC + 1
Sleep
have
Processor in
not
Sleep
PC + 2
been
T
OST (2)
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Inst(PC + 2)
Inst(PC + 1)
12.14 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant 7 bits of the ID locations are
used.
PC + 2
Interrupt Latency
Dummy Cycle
PC + 2
(3)
© 2007 Microchip Technology Inc.
Dummy Cycle
Inst(0004h)
0004h
Inst(0005h)
Inst(0004h)
0005h
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