MC56F8366VFVE Freescale Semiconductor, MC56F8366VFVE Datasheet - Page 43
![IC DSP 16BIT 60MHZ 144-LQFP](/photos/12/22/122242/mc56f8366vfve_sml.jpg)
MC56F8366VFVE
Manufacturer Part Number
MC56F8366VFVE
Description
IC DSP 16BIT 60MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet
1.MC56F8366VFVE.pdf
(182 pages)
Specifications of MC56F8366VFVE
Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
62
Program Memory Size
544KB (272K x 16)
Program Memory Type
FLASH
Ram Size
18K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Data Bus Width
16 bit
Processor Series
MC56F83xx
Core
56800E
Numeric And Arithmetic Format
Fixed-Point
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
62
Data Ram Size
4 KB
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Interface Type
SCI, SPI, CAN
Minimum Operating Temperature
- 40 C
Package
144LQFP
Family Name
56F8xxx
Maximum Speed
60 MHz
Operating Supply Voltage
3.3 V
On-chip Adc
4(4-chx12-bit)
Number Of Timers
16
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC56F8366VFVE
Manufacturer:
Freescale
Quantity:
43
Company:
Part Number:
MC56F8366VFVE
Manufacturer:
MOTOLOLA
Quantity:
439
Company:
Part Number:
MC56F8366VFVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC56F8366VFVE
Manufacturer:
FREESCALE
Quantity:
20 000
Note: Program RAM is NOT available on the 56F8166 device.
Freescale Semiconductor
Preliminary
1. If Flash Security Mode is enabled, EXTBOOT Mode 1 cannot be used. See Security Features, Part 7.
2. This mode provides maximum compatibility with 56F80x parts while operating externally.
3. “EMI_MODE =0” when EMI_MODE pin is tied to ground at boot up.
4. “EMI_MODE =1” when EMI_MODE pin is tied to V
5. Not accessible in reset configuration, since the address is above P:$00 FFFF. The higher bit address/GPIO (and/or chip se-
6. Not accessible in reset configuration, since the address is above P:$0F FFFF. The higher bit address/GPIO (and/or chip se-
7. Booting from this external address allows prototyping of the internal Boot Flash.
8. Two independent program flash blocks allow one to be programmed/erased while executing from another. Each block must
P:$1F FFFF
P:$10 0000
P:$0F FFFF
P:$05 0000
P:$04 FFFF
P:$04 F800
P:$04 F7FF
P:$04 4000
P:$04 3FFF
P:$04 0000
P:$03 FFFF
P:$02 0000
P:$01 FFFF
P:$01 0000
P:$00 FFFF
P:$00 0000
lects) pins must be reconfigured before this external memory is accessible.
lects) pins must be reconfigured before this external memory is accessible.
have its own mass erase.
Begin/End
Address
External Program Memory
Boot Flash
32KB
COP Reset Address = 04 0002
Boot Location = 04 0000
Internal Program Flash
256KB
Internal Program Flash
256KB
16-Bit External Address Bus
Mode 0 (MA = 0)
Internal Boot
Internal Boot
Table 4-4 Program Memory Map at Reset
On-Chip Program RAM
56F8366 Technical Data, Rev. 7
8
8
5
DD
Reserved
92KB
at boot up.
4KB
External Program Memory
Boot Flash
32KB
(Not Used for Boot in this Mode)
Internal Program Flash
256KB
Internal Program Flash
128KB
External Program Memory
COP Reset Address = 00 0002
Boot Location = 00 0000
16-Bit External Address Bus
EMI_MODE = 0
2
Mode 1
,
3
External Boot
5
1
(MA = 1)
External Program Memory
External Program Memory
COP Reset Address = 04 0002
Boot Location = 04 0000
20-Bit External Address Bus
EMI_MODE = 1
Program Map
4
7
6
7
43