MC9S12GC96MFAE Freescale Semiconductor, MC9S12GC96MFAE Datasheet - Page 684
![IC MCU 96K FLASH 25MHZ 48-LQFP](/photos/12/19/121954/mc9s12gc96mfae_sml.jpg)
MC9S12GC96MFAE
Manufacturer Part Number
MC9S12GC96MFAE
Description
IC MCU 96K FLASH 25MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12GC16MFUE.pdf
(690 pages)
Specifications of MC9S12GC96MFAE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
31
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S12GC
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
31
Number Of Timers
8
Operating Supply Voltage
3.3 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE, M68DKIT912C32SLK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48LQFP
Family Name
HCS12
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12GC96MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12GC96MFAE
Manufacturer:
FRE/MOT
Quantity:
20 000
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Appendix C Package Information
C.1.3
684
B
B1
9
AB
AC
T
12
1
48-Pin LQFP Package
4X
SECTION AE-AE
0.080
4X
0.200 AC T-U
Figure C-3. 48-Pin LQFP Mechanical Dimensions (Case no. 932-03 issue F)
48
13
S1
0.200 AB T-U
M
BASE METAL
A1
F
D
AC
G
A
S
T-U
N
Z
Z
Z
Z
J
37
24
AD
36
25
MC9S12C-Family / MC9S12GC-Family
U
V1
0.080 AC
DETAIL Y
V
Rev 01.24
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
NOTES:
1.
2.
3.
4.
5.
6.
7.
K
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
R
DIM
AA
A1
B1
V1
S1
W
G
H
K
M
A
B
C
D
E
F
L
N
P
R
V
J
S
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MIN
L °
0
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
°
°
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
7
°
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