MC9S12GC96MFAE Freescale Semiconductor, MC9S12GC96MFAE Datasheet - Page 682
![IC MCU 96K FLASH 25MHZ 48-LQFP](/photos/12/19/121954/mc9s12gc96mfae_sml.jpg)
MC9S12GC96MFAE
Manufacturer Part Number
MC9S12GC96MFAE
Description
IC MCU 96K FLASH 25MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12GC16MFUE.pdf
(690 pages)
Specifications of MC9S12GC96MFAE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
31
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S12GC
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
31
Number Of Timers
8
Operating Supply Voltage
3.3 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE, M68DKIT912C32SLK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48LQFP
Family Name
HCS12
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12GC96MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12GC96MFAE
Manufacturer:
FRE/MOT
Quantity:
20 000
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Appendix C Package Information
C.1.1
682
SEATING
PLANE
DATUM
PLANE
-C-
L
-A-
C
-H-
80-Pin QFP Package
E
H
61
80
60
DETAIL C
1
Figure C-1. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
G
0.20
0.05 A-B
0.20
W
M
M
X
H
C
K
A
S
L
A-B
A-B
DETAIL A
U
MC9S12C-Family / MC9S12GC-Family
R
-D-
T
S
S
D
D
Q
S
S
M
M
20
NOTES:
1.
2.
3.
4.
5.
6.
7.
Rev 01.24
41
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
40
21
-B-
B
DETAIL C
-H-
0.10
DATUM
PLANE
V
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
Freescale Semiconductor
B
B
M
C
DIM
M
W
F
D
A
B
C
D
E
F
G
H
K
L
N
P
Q
R
S
T
U
V
X
J
A-B
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
0.65 BSC
5
0
0
---
1.6 REF
°
°
°
S
°
-A-,-B-,-D-
14.10
14.10
17.45
17.45
N
MAX
D
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
P
10
7
---
---
°
°
S
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