MC9S08DV60ACLC Freescale Semiconductor, MC9S08DV60ACLC Datasheet - Page 17
![IC MCU 60K FLASH 3K RAM 32-LQFP](/photos/12/17/121791/mc9s08dv60aclc_sml.jpg)
MC9S08DV60ACLC
Manufacturer Part Number
MC9S08DV60ACLC
Description
IC MCU 60K FLASH 3K RAM 32-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08DV60ACLC
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
S08DV
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
3 KB
Interface Type
CAN, I2C, SCI, SPI
Number Of Programmable I/os
26
Operating Supply Voltage
5.5 V
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 10 channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DV60ACLC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Section Number
16.1 Introduction ....................................................................................................................................317
16.2 Signal Description ..........................................................................................................................322
16.3 Register Definition .........................................................................................................................326
16.4 Functional Description ...................................................................................................................332
16.5 Reset Overview ..............................................................................................................................337
16.6 Interrupts ........................................................................................................................................337
16.7 The Differences from TPM v2 to TPM v3.....................................................................................339
17.1 Introduction ....................................................................................................................................345
17.2 Background Debug Controller (BDC) ...........................................................................................346
17.3 On-Chip Debug System (DBG) .....................................................................................................355
Freescale Semiconductor
16.1.1 Features ...........................................................................................................................319
16.1.2 Modes of Operation ........................................................................................................319
16.1.3 Block Diagram ................................................................................................................320
16.2.1 Detailed Signal Descriptions ...........................................................................................322
16.3.1 TPM Status and Control Register (TPMxSC) ................................................................326
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL) ....................................................327
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL) ....................................328
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC) ..........................................329
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL) ..........................................330
16.4.1 Counter ............................................................................................................................332
16.4.2 Channel Mode Selection .................................................................................................334
16.5.1 General ............................................................................................................................337
16.5.2 Description of Reset Operation .......................................................................................337
16.6.1 General ............................................................................................................................337
16.6.2 Description of Interrupt Operation ..................................................................................338
17.1.1 Forcing Active Background ............................................................................................345
17.1.2 Features ...........................................................................................................................346
17.2.1 BKGD Pin Description ...................................................................................................347
17.2.2 Communication Details ..................................................................................................348
17.2.3 BDC Commands .............................................................................................................352
17.2.4 BDC Hardware Breakpoint .............................................................................................354
17.3.1 Comparators A and B ......................................................................................................355
17.3.2 Bus Capture Information and FIFO Operation ...............................................................355
17.3.3 Change-of-Flow Information ..........................................................................................356
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................356
17.3.5 Trigger Modes .................................................................................................................357
17.3.6 Hardware Breakpoints ....................................................................................................359
Timer Pulse-Width Modulator (S08TPMV3)
MC9S08DV60 Series Data Sheet, Rev 3
Development Support
Chapter 16
Chapter 17
Subject to Change
Title
Page
17
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