C8051F411-GM Silicon Laboratories Inc, C8051F411-GM Datasheet - Page 49

• Manufacturer Part Number: C8051F411-GM
• Description: IC 8051 MCU 32K FLASH 28QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F41xr

Specifications of C8051F411-GM

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 28-QFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 20
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.25 V
• Data Converters: A/D 20x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F4x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2368 B
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 20
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F410DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 20 Channel
• On-chip Dac: 12 bit, 2 Channel
• No. Of I/o's: 20
• Ram Memory Size: 2368Byte
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1454 - ADAPTER PROGRAM TOOLSTICK F411336-1317 - KIT EVAL FOR C8051F411336-1314 - KIT DEV FOR C8051F41X
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1309

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60  m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (67% Paste Coverage).
Small Body Components.
Figure 4.6. QFN-28 Recommended PCB Land Pattern
Table 4.5. QFN-28 PCB Land Pattern Dimensions
0.20
Min
4.80
4.80
0.50
Max
0.30
Rev. 1.1
Dimension
X2
Y1
Y2
C8051F410/1/2/3
3.20
0.85
3.20
Min
Max
3.30
0.95
3.30
49