C8051F411-GM Silicon Laboratories Inc, C8051F411-GM Datasheet - Page 268

• Manufacturer Part Number: C8051F411-GM
• Description: IC 8051 MCU 32K FLASH 28QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F41xr

Specifications of C8051F411-GM

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 28-QFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 20
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.25 V
• Data Converters: A/D 20x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F4x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2368 B
• Interface Type: I2C, SMBus, SPI, UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 20
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F410DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 20 Channel
• On-chip Dac: 12 bit, 2 Channel
• No. Of I/o's: 20
• Ram Memory Size: 2368Byte
• Cpu Speed: 50MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1454 - ADAPTER PROGRAM TOOLSTICK F411336-1317 - KIT EVAL FOR C8051F411336-1314 - KIT DEV FOR C8051F41X
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1309

C8051F410/1/2/3
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268
OCUMENT
Updated specification tables with most recently available characterization data.
Corrected references to configuring pins for Analog Mode - Port Latch must contain a '1'.
SFR Definition 5.6: Address correction to 0xBA.
Added Figure 8.2 showing power connection diagram without using on-chip regulator.
Section 9
Table 11.2 : Corrected SFR Name P2MDIN on location 0xF3.
Section 14
Section 18
last sentence.
Section 19.2.2
Section 19.3
cies.
Section 21
Table 21.4 : Made corrections to SMBus state descriptions.
Figure 24.6 : Corrected T2RCLK Mux selection options.
Figure 24.9 : Corrected T3RCLK Mux selection options.
C2 Register Definition 26.2 : Corrected DEVICEID value to 0x0C.
Updated specification tables with full characterization data.
Updated Flash write and erase procedures to include a write to FLSCL.3-0.
Changed /RST pin comments in Table 4.1, “Pin Definitions for the C8051F41x,” on page 41 for the recom-
mended pull-up resistor.
Changed the reset value of the SFR Definition 16.3. FLSCL: Flash Scale.
Removed the "Optional GND Connection" from Figure 4.5. ’Typical QFN-28 Landing Diagram’ on page 48.
Added a note regarding the maximum SYSCLK frequency to SFR Definition 19.4. CLKMUL: Clock Multi-
plier Control.
Updated Figure 4.3. ’LQFP-32 Package Diagram’ on page 46, Figure 4.5. ’QFN-28 Package Drawing’ on
page 48, and Figure 4.6. ’QFN-28 Recommended PCB Land Pattern’ on page 49.
Added note that VIO must be > VDD in Table 3.1, “Global DC Electrical Characteristics,” on page 36.
Added information about ADC0 output register auto-clearing in SFR Definition 5.2.
Corrected ADC0 Tracking time equation in SFR Definition 5.6.
Clarified Voltage Regulator Electrical Specifications in Table 8.1 on page 82.
Added information about 16-bit and 32-bit CRC algorithms in
: Removed references to "High Speed Analog Mode".
, Important Note on page 151 : Added "and have the same behavior as P0 in Normal Mode." to
: Corrected SMBus maximum rate to 1/20th system clock.
: Corrected operational description of CRC engine.
: Added Figure 19.3 and text to describe behavior of clock multiplier with slower input frequen-
C
: Inserted Step 3 "Release the crystal pins by writing ‘1's to the port latch."
HANGE
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Rev. 1.1
Section 14
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