ST10F269Z2Q3 STMicroelectronics, ST10F269Z2Q3 Datasheet - Page 133

• Manufacturer Part Number: ST10F269Z2Q3
• Description: IC FLASH MEM 256KBIT 144-PQFP
• Manufacturer: STMicroelectronics
• Series: ST10r

Specifications of ST10F269Z2Q3

• Core Processor: ST10
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SSC, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 111
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-QFP
• Processor Series: ST10F26x
• Core: ST10
• Data Bus Width: 16 bit
• Data Ram Size: 12 KB
• Interface Type: CAN, SSC, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 111
• Number Of Timers: 2 x 16 bit
• Operating Supply Voltage: 0.3 V to 4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit x 10 bit
• Cpu Family: ST10
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 12KB
• # I/os (max): 111
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: CISC/RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2042

ST10F269
BUSCON0 (FF0Ch / 86h)
BUSCON1 (FF14h / 8Ah)
BUSCON2 (FF16h / 8Bh)
BUSCON3 (FF18h / 8Ch)
CLKEN
BYTDIS
ROMEN
SGTDIS
ROMS1
STKSZ
CSWEN0 CSREN0 RDYPOL0 RDYEN0
CSWEN1 CSREN1 RDYPOL1 RDYEN1
CSWEN2 CSREN2 RDYPOL2 RDYEN2
CSWEN3 CSREN3 RDYPOL3 RDYEN3
RW
RW
RW
RW
15
15
15
15
RW
RW
RW
RW
14
14
14
14
‘0’: Pins WR and BHE retain their normal function
‘1’: Pin WR acts as WRL, pin BHE acts as WRH.
System Clock Output Enable (CLKOUT)
‘0’: CLKOUT disabled: pin may be used for general purpose I/O
‘1’: CLKOUT enabled: pin outputs the system clock signal.
Disable/Enable Control for Pin BHE (Set according to data bus width)
‘0’: Pin BHE enabled
‘1’: Pin BHE disabled, pin may be used for general purpose I/O.
Internal Memory Enable (Set according to pin EA during reset)
‘0’: Internal Memory disabled: accesses to the Memory area use the external bus
‘1’: Internal Memory enabled.
Segmentation Disable/Enable Control
‘0’: Segmentation enabled (CSP is saved/restored during interrupt entry/exit)
‘1’: Segmentation disabled (Only IP is saved/restored).
Internal Memory Mapping
‘0’: Internal Memory area mapped to segment 0 (00’0000H...00’7FFFH)
‘1’: Internal Memory area mapped to segment 1 (01’0000H...01’7FFFH).
System Stack Size
Selects the size of the system stack (in the internal RAM) from 32 to 1024 words.
RW
RW
RW
RW
13
13
13
13
RW
RW
RW
RW
12
12
12
12
11
11
11
11
-
-
-
-
BUS ACT0 ALE CTL0
BUSACT1
BUSACT2
BUSACT3
RW
RW
RW
RW
10
10
10
10
20 - SPECIAL FUNCTION REGISTER OVERVIEW
2
SFR
SFR
SFR
SFR
ALECTL1
ALECTL2
ALECTL3
RW
RW
RW
RW
9
9
9
9
2
8
8
8
8
-
-
-
-
7
7
7
7
BTYP
BTYP
BTYP
BTYP
RW
RW
RW
RW
1
6
6
6
6
MTTC0 RWDC0
MTTC1 RWDC1
MTTC2 RWDC2
MTTC3 RWDC3
RW
RW
RW
RW
5
5
5
5
RW
RW
RW
RW
4
4
4
4
Reset Value: 0000h
Reset Value: 0000h
Reset Value: 0000h
Reset Value: 0xx0h
3
3
3
3
MCTC
MCTC
MCTC
MCTC
2
2
2
2
RW
RW
RW
RW
133/184
1
1
1
1
0
0
0
0