LPC2366FBD100,551 NXP Semiconductors, LPC2366FBD100,551 Datasheet - Page 6

IC ARM7 MCU FLASH 256K 100LQFP

LPC2366FBD100,551

Manufacturer Part Number
LPC2366FBD100,551
Description
IC ARM7 MCU FLASH 256K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2366FBD100,551

Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
58K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
58 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
58KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-3996
935282462551
LPC2366FBD100-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2366FBD100,551
Quantity:
9 999
Part Number:
LPC2366FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
6. Pinning information
Table 3.
LPC2364_65_66_67_68_6
Product data sheet
Pin Symbol
Row A
1
5
9
Row B
1
TDO
P1[10]/ENET_RXD1
P0[7]/I2STX_CLK/
SCK1/MAT2[1]
TMS
Pin allocation table
6.1 Pinning
Fig 2.
Fig 3.
Pin Symbol
2
6
10
2
LPC2364/68 pinning TFBGA100 package
LPC2364/65/66/67/68 pinning
P0[3]/RXD0
P1[16]/ENET_MDC
P0[9]/I2STX_SDA/
MOSI1/MAT2[3]
RTCK
Rev. 06 — 1 February 2010
ball A1
index area
25
G
C
D
H
A
B
E
F
K
1
J
LPC2364FET100/LPC2368FET100
Pin Symbol
3
7
11
3
1
LPC2364FBD100
LPC2365FBD100
LPC2366FBD100
LPC2367FBD100
LPC2368FBD100
2
V
V
-
V
DD(3V3)
DD(DCDC)(3V3)
SS
3
Transparent top view
4
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
5
6
7
002aac576
75
8
51
002aad225
9
10
Pin Symbol
4
8
12
4
P1[4]/ENET_TX_EN
P0[4]/I2SRX_CLK/
RD2/CAP2[0]
-
P1[1]/ENET_TXD1
© NXP B.V. 2010. All rights reserved.
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