LPC2366FBD100,551 NXP Semiconductors, LPC2366FBD100,551 Datasheet - Page 32

• Manufacturer Part Number: LPC2366FBD100,551
• Description: IC ARM7 MCU FLASH 256K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2366FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 256KB (256K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 72MHz
• Total Internal Ram Size: 58KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-3996; 935282462551; LPC2366FBD100-S

NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
7.24.4.3 Power-down mode
7.24.4.4 Deep power-down mode
7.24.4.5 Power domains
On the wake-up of Sleep mode, if the IRC was used before entering Sleep mode, the
code execution and peripherals activities will resume after 4 cycles expire. If the main
external oscillator was used, the code execution will resume when 4096 cycles expire.
The customers need to reconfigure the PLL and clock dividers accordingly.
Power-down mode does everything that Sleep mode does, but also turns off the IRC
oscillator and the flash memory. This saves more power, but requires waiting for
resumption of flash operation before execution of code or data access in the flash memory
can be accomplished.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 μs to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. In the meantime, the
flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 μs flash start-up
time. When it times out, access to the flash will be allowed. The customers need to
reconfigure the PLL and clock dividers accordingly.
Deep power-down mode is similar to the Power-down mode, but now the on-chip
regulator that supplies power to the internal logic is also shut off. This produces the lowest
possible power consumption without removing power from the entire chip. Since the Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full chip
reset.
If power is supplied to the LPC2364/65/66/67/68 during Deep power-down mode,
wake-up can be caused by the RTC Alarm interrupt or by external Reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2364/65/66/67/68 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the Battery RAM, as long as the external power
to the VBAT pin is maintained.
The LPC2364/65/66/67/68 provides two independent power domains that allow the bulk
of the device to have power removed while maintaining operation of the RTC and the
battery RAM.
On the LPC2364/65/66/67/68, I/O pads are powered by the 3.3 V (V
the V
power to the CPU and most of the peripherals.
Depending on the LPC2364/65/66/67/68 application, a design can use two power options
to manage power consumption.
DD(DCDC)(3V3)
pin powers the on-chip DC-to-DC converter which in turn provides
Rev. 06 — 1 February 2010
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
DD(3V3)
© NXP B.V. 2010. All rights reserved.
) pins, while
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