LPC3250FET296/01,5 NXP Semiconductors, LPC3250FET296/01,5 Datasheet - Page 6

• Manufacturer Part Number: LPC3250FET296/01,5
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3250FET296/01,5

• Package / Case: 296-TFBGA
• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: EMC
• Maximum Clock Frequency: 266 MHz
• Number Of Timers: 6
• Operating Supply Voltage: 1.31 V to 1.39 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
• Development Tools By Supplier: OM11016, OM11021, OM11045
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4962; 935290766551

NXP Semiconductors
Table 3.
LPC3220_30_40_50_1
Preliminary data sheet
Pin
C10 SPI1_DATIN/MISO0/GPI_25/
C13 GPO_8/LCDVD[8]
C16 GPI_0/I2S1RX_SDA
Row D
D1
D4
D7
D10 GPO_16/MCOB0/LCDENAB/
D13 GPI_7/CAP4[0]/MCABORT
D16 KEY_ROW3/ENET_TX_EN
Row E
E1
E4
E7
E10 GPO_22/U7_HRTS/LCDVD[14]
E13 GPI_4/SPI1_BUSY
E16 KEY_COL1/ENET_RX_CLK/
Row F
F1
F4
F7
F10 VSS_IOD
F13 VDD_IOD
F16 KEY_COL5/ENET_RXD1
Row G
G1
G4
G7
G10 VSS_CORE
G13 U7_HCTS/CAP0[1]/
G16 U6_IRTX
Row H
H1
H4
H7
H13 VDD_IOA
Symbol
MCI1
FLASH_RDY
GPO_1
P0[1]/I2S1RX_WS
LCDM
FLASH_IO[3]
I2C2_SDA
I2S1TX_SDA/MAT3[1]
ENET_REF_CLK
FLASH_IO[2]
GPI_3
VDD_IOC
EMC_DYCS1
RESOUT
VDD_CORE
LCDCLKIN/GPI_22
EMC_OE
FLASH_IO[4]
VSS_CORE
Pin allocation table (TFBGA296)
Pin
C11 GPIO_3/KEY_ROW7/
C14 GPI_2/CAP2[0]/
C17 KEY_ROW4/ENET_TXD0
D2
D5
D8
D11 GPO_18/MCOA0/LCDLP
D14 PWM_OUT1/LCDVD[16]
D17 KEY_COL2/ENET_RX_ER
E2
E5
E8
E11 GPO_10/MCOB2/LCDPWR
E14 KEY_ROW1/ENET_TXD2
E17 U7_RX/CAP0[0]/LCDVD[10]/
F2
F5
F8
F11 VSS_IOD
F14 KEY_ROW2/ENET_TXD3
F17 U6_IRRX/GPI_21
G2
G5
G8
G11 VDD_CORE
G14 DBGEN
G17 SYSCLKEN/LCDVD[15]
H2
H5
H14 JTAG_TCK
Symbol
ENET_MDIO
ENET_RXD3
FLASH_ALE
USB_DAT_VP/U5_RX
GPO_4
FLASH_IO[7]
USB_I2C_SCL
GPO_11
GPI_23
FLASH_WR
VSS_IOC
VDD_IOB
FLASH_IO[5]
VSS_IOC
VSS_CORE
FLASH_IO[0]
VSS_IOC
Rev. 01 — 6 February 2009
Pin
C12 GPO_9/LCDVD[9]
C15 GPI_1/SERVICE
C18 KEY_ROW5/ENET_TXD1
D3
D6
D9
D12 GPO_3/LCDVD[1]
D15 PWM_OUT2/INTSTAT/LCDVD[19]
D18 KEY_COL3/ENET_CRS
E3
E6
E9
E12 GPI_9/KEY_COL7/ENET_COL
E15 KEY_ROW0/ENET_TX_ER
E18 U7_TX/MAT1[1]/LCDVD[11]
F3
F6
F9
F12 VSS_IOD
F15 KEY_COL0/ENET_TX_CLK
F18 U5_RX/GPI_20
G3
G6
G9
G12 VSS_CORE
G15 KEY_COL4/ENET_RXD0
G18 JTAG_TMS
H3
H6
H12 VSS_IOD
H15 U5_TX
LPC3220/30/40/50
Symbol
GPO_14
USB_OE_TP
GPIO_2/KEY_ROW6/ENET_MDC
FLASH_CE
USB_I2C_SDA
GPIO_5/SSEL0/MCI0
FLASH_CLE
VSS_IOB
VDD_IOD
FLASH_IO[6]
VDD_IOC
VDD_CORE
FLASH_IO[1]
VDD_IOC
16/32-bit ARM microcontrollers
© NXP B.V. 2009. All rights reserved.
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