LPC2210FBD144/01,5 NXP Semiconductors, LPC2210FBD144/01,5 Datasheet - Page 5

• Manufacturer Part Number: LPC2210FBD144/01,5
• Description: IC ARM7 MCU 16KRAM W/ADC 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2200r

Specifications of LPC2210FBD144/01,5

• Program Memory Type: ROMless
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 76
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC22
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM10091 - KIT DEV PHYCORE-ARM7/LPC2220622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-1757 - BOARD EVAL FOR LPC220X ARM MCU
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4012; 935282078551; LPC2210FBD144/01-S

NXP Semiconductors
5. Pinning information
LPC2210_2220_6
Product data sheet
5.1 Pinning
Fig 2. Pin configuration for LQFP144
Fig 3. Ball configuration diagram for TFBGA144
Rev. 06 — 11 December 2008
ball A1
index area
36
C
D
G
H
M
N
1
A
B
E
F
K
J
L
LPC2210FBD144/01
1
LPC2210FBD144
LPC2220FBD144
2
3
Transparent top view
LPC2220FET144
4
5
6
7
8
9
10
002aaa794
108
73
11
16/32-bit ARM microcontrollers
002aab245
12
LPC2210/2220
13
© NXP B.V. 2008. All rights reserved.
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