LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 51
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LPC1313FBD48,151
Manufacturer Part Number
LPC1313FBD48,151
Description
IC MCU 32BIT 32KB FLASH 48LQFP
Manufacturer
NXP Semiconductors
Series
LPC13xxr
Specifications of LPC1313FBD48,151
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
I²C, Microwire, SPI, SSI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
42
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC13
Core
ARM Cortex M3
Data Bus Width
32 bit
Interface Type
I2C, UART
Maximum Clock Frequency
72 MHz
Number Of Timers
2
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
OM11041
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
LPC1000
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
8KB
# I/os (max)
42
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Package
48LQFP
Family Name
LPC1000
Maximum Speed
72 MHz
Number Of Programmable I/os
42
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4914
935289651151
935289651151
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1313FBD48,151
Manufacturer:
MAXIM
Quantity:
1 560
Company:
Part Number:
LPC1313FBD48,151
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC1311_13_42_43
Product data sheet
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 19
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer.
Fig 28. Slave mode operation of the on-chip oscillator
Fig 29. Oscillator modes and models: oscillation mode of operation and external crystal
S
). Capacitance C
28), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
and
model used for C
Table
All information provided in this document is subject to legal disclaimers.
XTALIN
P
C X1
20. Since the feedback resistance is integrated on chip, only a crystal
LPC1xxx
in
Rev. 3 — 10 August 2010
Figure 29
X1
XTAL
X1
and C
/C
X2
XTALOUT
X2
evaluation
C X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
XTALIN
LPC1xxx
C i
100 pF
, C
L
, R
S
002aae788
32-bit ARM Cortex-M3 microcontroller
C g
and C
LPC1311/13/42/43
=
P
are supplied by the crystal
L
C L
R S
002aaf424
© NXP B.V. 2010. All rights reserved.
C P
Figure 29
L
and
and in
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