LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 51

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
LPC1311_13_42_43
Product data sheet
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 19
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer.
Fig 28. Slave mode operation of the on-chip oscillator
Fig 29. Oscillator modes and models: oscillation mode of operation and external crystal
S
). Capacitance C
28), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
and
model used for C
Table
All information provided in this document is subject to legal disclaimers.
XTALIN
P
C X1
20. Since the feedback resistance is integrated on chip, only a crystal
LPC1xxx
in
Rev. 3 — 10 August 2010
Figure 29
X1
XTAL
X1
and C
/C
X2
XTALOUT
X2
evaluation
C X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
XTALIN
LPC1xxx
C i
100 pF
, C
L
, R
S
002aae788
32-bit ARM Cortex-M3 microcontroller
C g
and C
LPC1311/13/42/43
=
P
are supplied by the crystal
L
C L
R S
002aaf424
© NXP B.V. 2010. All rights reserved.
C P
Figure 29
L
and
and in
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