LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 42

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
10. Dynamic characteristics
Table 11.
T
[1]
[2]
Table 12.
T
[1]
[2]
LPC1311_13_42_43
Product data sheet
Symbol
N
t
t
t
Symbol
f
T
t
t
t
t
ret
er
prog
osc
CHCX
CLCX
CLCH
CHCL
amb
amb
Fig 20. External clock timing (with an amplitude of at least V
cy(clk)
endu
Number of program/erase cycles.
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
= −40 °C to +85 °C, unless otherwise specified.
= −40 °C to +85 °C; V
Flash characteristics
Dynamic characteristic: external clock
10.1 Flash memory
10.2 External clock
Parameter
endurance
retention time
erase time
programming time
Parameter
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
DD
over specified ranges.
All information provided in this document is subject to legal disclaimers.
sector or multiple
Conditions
powered
unpowered
consecutive sectors
t
CHCL
Rev. 3 — 10 August 2010
[1]
Conditions
t
CLCX
i(RMS)
T
cy(clk)
= 200 mV)
t
CLCH
t
[1]
[2]
CHCX
Min
1
40
T
T
-
-
cy(clk)
cy(clk)
32-bit ARM Cortex-M3 microcontroller
Min
10000
10
20
95
0.95
LPC1311/13/42/43
× 0.4
× 0.4
002aaa907
Typ
-
-
100
1
-
Typ
-
-
-
-
-
-
[2]
© NXP B.V. 2010. All rights reserved.
1.05
Max
-
-
-
105
Max
25
1000
-
-
5
5
Unit
cycles
years
years
ms
42 of 62
ms
Unit
MHz
ns
ns
ns
ns
ns