DSPIC30F6010-30I/PF Microchip Technology, DSPIC30F6010-30I/PF Datasheet - Page 210

• Manufacturer Part Number: DSPIC30F6010-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6010-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 144KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F601030IPF

dsPIC30F6010
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70119E-page 208
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-116
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
c
Dimension Limits
#leads = n1
E1
E
Units
n1
A2
E1
D1
A1
p
L
F
E
D
B
n
A
c
n
MIN
.037
.002
.018
.004
.011
11°
11°
2
1
0°
L
D1
INCHES
.039 REF.
.630 BSC
.630 BSC
.551 BSC
.551 BSC
A
NOM
A1
D
.026
.039
.024
.013
3.5°
12°
12°
80
20
MAX
(F)
.047
.041
.006
.030
.008
.015
13°
13°
7°
MIN
0.95
0.05
0.45
0.09
0.27
11°
11°
0°
MILLIMETERS*
© 2006 Microchip Technology Inc.
Revised 7-20-06
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF.
NOM
0.65
1.00
0.60
0.32
3.5°
12°
12°
80
20
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.37
13°
13°
7°