PIC18LF442-I/ML Microchip Technology, PIC18LF442-I/ML Datasheet - Page 309
![IC MCU FLASH 8KX16 EE A/D 44QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18LF442-I/ML
Manufacturer Part Number
PIC18LF442-I/ML
Description
IC MCU FLASH 8KX16 EE A/D 44QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16LF627A-IP.pdf
(8 pages)
3.PIC18F242-ISO.pdf
(332 pages)
4.PIC18F242-ISO.pdf
(14 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(16 pages)
7.PIC18F242-ISO.pdf
(14 pages)
8.PIC18LF242-ISO.pdf
(36 pages)
Specifications of PIC18LF442-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
- PIC16F616T-ISL PDF datasheet
- PIC16LF627A-IP PDF datasheet #2
- PIC18F242-ISO PDF datasheet #3
- PIC18F242-ISO PDF datasheet #4
- PIC18F242-ISO PDF datasheet #5
- PIC18F242-ISO PDF datasheet #6
- PIC18F242-ISO PDF datasheet #7
- PIC18LF242-ISO PDF datasheet #8
- Current page: 309 of 332
- Download datasheet (6Mb)
24.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
PIC18FXX2
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
DS39564C-page 307
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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