DSPIC33FJ64GP802-E/SO Microchip Technology, DSPIC33FJ64GP802-E/SO Datasheet - Page 340
![IC DSPIC MCU/DSP 64K 28-SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC33FJ64GP802-E/SO
Manufacturer Part Number
DSPIC33FJ64GP802-E/SO
Description
IC DSPIC MCU/DSP 64K 28-SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
Specifications of DSPIC33FJ64GP802-E/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b, D/A 4x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
21
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
On-chip Dac
2-chx16-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164339 - MODULE SKT FOR PM3 28SOICDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- Current page: 340 of 402
- Download datasheet (3Mb)
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
FIGURE 30-9:
TABLE 30-28: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
DS70292D-page 340
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 30-1 for load conditions.
(CKP = 0)
(CKP = 1)
SDIx
SCKx
SDOx
SCKx
2:
3:
4:
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Characteristic
SP35
SP31
SP11
SP40 SP41
MSb In
MSb
SP10
(1)
Preliminary
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
T
T
Min
CY
CY
23
30
—
—
—
—
—
/2
/2
SP21
SP20
Typ
—
—
—
—
—
—
—
—
6
(2)
SP30
SP20
SP21
Max
LSb In
20
LSb
—
—
—
—
—
—
—
—
-40°C T
-40°C T
Units
2009 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
+85°C for Industrial
+125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 4
See parameter D031
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
Conditions
—
—
—
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