PIC16F84A-20/SO Microchip Technology, PIC16F84A-20/SO Datasheet - Page 38

• Manufacturer Part Number: PIC16F84A-20/SO
• Description: IC MCU FLASH 1KX14 EE 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F84A-20/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 13
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 68Byte
• Cpu Speed: 20MHz
• No. Of Timers: 1
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 68 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F84A - BOARD DAUGHTER ICEPIC3309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PICmicro MID-RANGE MCU FAMILY
2.3.3
DS31002A-page 2-8
Tuning the Oscillator Circuit
Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;
depending on the part and version ordered) and external components (crystals, capacitors,...),
of varying quality and manufacture; validation of operation needs to be performed to ensure that
the component selection will comply with the requirements of the application.
There are many factors that go into the selection and arrangement of these external components.
These factors include:
• amplifier gain
• desired frequency
• resonant frequency(s) of the crystal
• temperature of operation
• supply voltage range
• start-up time
• stability
• crystal life
• power consumption
• simplification of the circuit
• use of standard components
• combination which results in fewest components
1997 Microchip Technology Inc.