DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 11

IC DSPIC MCU/DSP 24K 18DIP

DSPIC30F3012-30I/P

Manufacturer Part Number
DSPIC30F3012-30I/P
Description
IC DSPIC MCU/DSP 24K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/P

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F3012-30IP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
Microchip Technology
Quantity:
1 936
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
TI
Quantity:
6
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F3012-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2010 Microchip Technology Inc.
Note:
Work around 2:
Instead of executing a PWRSAV #0 instruction to
put the device into Sleep mode, perform a clock
switch to the 512 kHz Low-Power RC (LPRC)
Oscillator with a 64:1 postscaler mode. This
enables the device to operate at 0.002 MIPS,
thereby
consumption of the device. Similarly, instead of
using an interrupt to wake-up the device from
Sleep mode, perform another clock switch back to
the original oscillator source to resume normal
operation. Depending on the device, refer to
Section 7. “Oscillator” (DS70054) or Section
29. “Oscillator” (DS70268) in the “dsPIC30F
Family Reference Manual” (DS70046) for more
details on performing a clock switch operation.
The above work around is recommended
for users for whom application hardware
changes are not possible.
significantly
reducing
the
current
Note:
Work around 3:
Instead of executing a PWRSAV #0 instruction to
put the device into Sleep mode, perform a clock
switch to the 32 kHz Low-Power (LP) Oscillator
with a 64:1 postscaler mode. This enables the
device to operate at 0.000125 MIPS, thereby
significantly reducing the current consumption of
the device. Similarly, instead of using an interrupt
to wake-up the device from Sleep mode, perform
another clock switch back to the original oscillator
source to resume normal operation. Depending on
the device, refer to Section 7. “Oscillator”
(DS70054)
(DS70268) in the “dsPIC30F Family Reference
Manual” (DS70046) for more details on performing
a clock switch operation.
Affected Silicon Revisions
B0
X
The above work around is recommended
for users for whom application hardware
changes are possible, and also for users
whose
includes a 32 kHz LP Oscillator crystal.
dsPIC30F3012/3013
B1
X
or
application
Section
hardware
29.
DS80448D-page 11
“Oscillator”
already

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