DSPIC33FJ32MC202-I/MM Microchip Technology, DSPIC33FJ32MC202-I/MM Datasheet - Page 410
DSPIC33FJ32MC202-I/MM
Manufacturer Part Number
DSPIC33FJ32MC202-I/MM
Description
IC DSPIC MCU/DSP 32K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
4.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
5.DSPIC33FJ32MC204-IPT.pdf
(304 pages)
Specifications of DSPIC33FJ32MC202-I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Package
28QFN-S EP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC202-I/MM
Manufacturer:
Microchip
Quantity:
1 485
Part Number:
DSPIC33FJ32MC202-I/MM
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ32MC202-IMM PDF datasheet #3
- DSPIC33FJ32MC302-ISO PDF datasheet #4
- DSPIC33FJ32MC204-IPT PDF datasheet #5
- Current page: 410 of 436
- Download datasheet (6Mb)
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70291E-page 410
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
E
A
EXPOSED
NOTE 1
Units
A1
A3
E2
D2
PAD
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.30
0.20
MIN
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
D2
–
Microchip Technology Drawing C04-124B
© 2011 Microchip Technology Inc.
MAX
1.00
0.05
4.70
4.70
0.43
0.50
–
L
b
e
K
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