DSPIC33FJ32MC202-I/MM Microchip Technology, DSPIC33FJ32MC202-I/MM Datasheet - Page 399

• Manufacturer Part Number: DSPIC33FJ32MC202-I/MM
• Description: IC DSPIC MCU/DSP 32K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ32MC202-I/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-QFN
• Core Frequency: 40MHz
• Core Supply Voltage: 2.75V
• Embedded Interface Type: I2C, JTAG, SPI, UART
• No. Of I/o's: 21
• Flash Memory Size: 32KB
• Supply Voltage Range: 3V To 3.6V
• Package: 28QFN-S EP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit|6-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

TABLE 32-5:
TABLE 32-6:
TABLE 32-7:
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
HDC72a
HDC72f
HDC72g
Note 1:
DC CHARACTERISTICS
HDO10
HDO16
HDO20
HDO26
DC CHARACTERISTICS
HD130 E
HD134 T
Note 1:
Parameter
Param
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
Param
No.
No.
No.
2:
Symbol
V
V
RETD
Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
P
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is not allowed above 125°C.
Symbol
OL
OH
Typical
DC CHARACTERISTICS: DOZE CURRENT (I
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS: PROGRAM MEMORY
Program Flash Memory
Cell Endurance
Characteristic Retention
39
18
18
Output Low Voltage
I/O ports
OSC2/CLKO
Output High Voltage
I/O ports
OSC2/CLKO
(1)
Characteristic
Characteristic
Max
45
25
25
(1)
10,000
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
20
2.40
2.41
Min
Ratio
1:128
Doze
1:64
—
—
1:2
Typ
—
—
Typ
Units
—
—
—
—
mA
mA
mA
Max
—
—
Max
DOZE
0.4
0.4
—
—
+150°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
)
Year
E/W
Units
V
V
V
V
-40°C to +150°C
1000 E/W cycles or less and no
other specifications are violated
A
A
A
≤ +150°C for High Temperature
≤ +150°C for High Temperature
I
I
I
I
≤ +150°C for High Temperature
OL
OL
OH
OH
3.3V
Conditions
= 1 mA, V
= 1 mA, V
= -1 mA, V
= -1 mA, V
Conditions
Conditions
DS70291E-page 399
DD
DD
(2)
DD
DD
20 MIPS
= 3.3V
= 3.3V
= 3.3V
= 3.3V