PIC18F14K22-I/SO Microchip Technology, PIC18F14K22-I/SO Datasheet - Page 7
![IC PIC MCU FLASH 512KX16 20-SOIC](/photos/6/64/66480/150-20-soic_sml.jpg)
PIC18F14K22-I/SO
Manufacturer Part Number
PIC18F14K22-I/SO
Description
IC PIC MCU FLASH 512KX16 20-SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18LF13K22-ISS.pdf
(388 pages)
3.PIC18LF13K22-ISS.pdf
(12 pages)
4.PIC18LF13K22-ISS.pdf
(36 pages)
5.PIC18F13K22-ISS.pdf
(382 pages)
Specifications of PIC18F14K22-I/SO
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, MSSP, SPI, USART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
A/d Bit Size
10 bit
A/d Channels Available
12
Height
2.05 mm
Length
12.8 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V, 2.7 V
Width
7.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F14K22-I/SO
Manufacturer:
Microchip Technology
Quantity:
1 786
Part Number:
PIC18F14K22-I/SO
Manufacturer:
MIC
Quantity:
20 000
3.1
Figure 3-4 shows the high-level overview of the
programming process. First, a Bulk Erase is performed.
Next, the program Flash, ID locations and data
EEPROM are programmed. These memories are then
verified to ensure that programming was successful. If
no errors are detected, the Configuration bits are then
programmed and verified.
FIGURE 3-4:
© 2009 Microchip Technology Inc.
High-Level Overview of the
Programming Process
Program Data EE
Configuration Bits
Program Memory
Configuration Bits
Verify Program
Perform Bulk
Program IDs
Verify Data
Verify IDs
Program
HIGH-LEVEL
PROGRAMMING FLOW
Erase
Verify
Done
Start
Advance Information
PIC18F1XK22/LF1XK22
3.2
As shown in Figure 3-6, the High-Voltage ICSP
Program/Verify mode is entered by holding PGC and
PGD low and then raising MCLR/V
(high voltage). Once in this mode, the program Flash,
data EEPROM, ID locations and Configuration bits can
be accessed and programmed in serial fashion.
Figure 3-7 shows the exit sequence.
The sequence that enters the device into the Program/
Verify mode places all unused I/Os in the high-impedance
state.
FIGURE 3-5:
FIGURE 3-6:
MCLR/V
V
PGD
PGC
MCLR/V
V
PGD
PGC
Note:
DD
DD
Entering and Exiting High-Voltage
ICSP Program/Verify Mode
D110
D110
PP
PP
/RA3
/RA3
P1
This method of entry is valid, regardless
of Configuration Word selected.
PGD = Input
PGD = Input
P13
V
VERIFY MODE ENTRY
V
VERIFY MODE ENTRY
P1
PP
DD
P13
-FIRST PROGRAM/
-FIRST PROGRAM/
P12
P12
DS41357B-page 7
PP
/RA3 to V
IHH