PIC18F14K22-I/SO Microchip Technology, PIC18F14K22-I/SO Datasheet - Page 20

• Manufacturer Part Number: PIC18F14K22-I/SO
• Description: IC PIC MCU FLASH 512KX16 20-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F14K22-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 20-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, MSSP, SPI, USART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 2.05 mm
• Length: 12.8 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V, 2.7 V
• Width: 7.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F1XK22/LF1XK22
4.4
The ID locations are programmed much like the
program Flash. The ID registers are mapped in
addresses 200000h through 200007h. These locations
read out normally even after code protection.
TABLE 4-8:
DS41357B-page 20
Step 1: Direct access to program Flash.
0000
0000
0000
Step 2: Set Table Pointer to ID. Load write buffer with 8 bytes and write.
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
Note:
Command
4-bit
ID Location Programming
The user only needs to fill the first 8 bytes
of the write buffer in order to write the ID
locations.
WRITE ID SEQUENCE
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
Data Payload
8E A6
9C A6
84 A6
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
00 00
BSF EECON1, EEPGD
BCF EECON1, CFGS
BSF EECON1, WREN
MOVLW 20h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 00h
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2.
Write 2 bytes and post-increment address by 2.
Write 2 bytes and post-increment address by 2.
Write 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
Advance Information
Table 4-8 demonstrates the code sequence required to
write the ID locations.
In order to modify the ID locations, refer to the
methodology described in Section 4.2.1 “Modifying
Program Flash”. As with program Flash, the ID
locations must be erased before being modified.
Core Instruction
© 2009 Microchip Technology Inc.