PIC18F14K22-I/SO Microchip Technology, PIC18F14K22-I/SO Datasheet - Page 22

• Manufacturer Part Number: PIC18F14K22-I/SO
• Description: IC PIC MCU FLASH 512KX16 20-SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F14K22-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 20-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, MSSP, SPI, USART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 2.05 mm
• Length: 12.8 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V, 2.7 V
• Width: 7.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18F1XK22/LF1XK22
5.0
5.1
Program Flash is accessed one byte at a time via the
4-bit command, ‘1001’ (table read, post-increment).
The contents of memory pointed to by the Table Pointer
(TBLPTRU:TBLPTRH:TBLPTRL) are serially output on
PGD.
TABLE 5-1:
FIGURE 5-1:
DS41357B-page 22
Step 1: Set Table Pointer
0000
0000
0000
0000
0000
0000
Step 2: Read memory and then shift out on PGD, LSb to MSb
1001
PGC
Command
PGD
Note 1:
4-bit
READING THE DEVICE
Read Program Flash, ID Locations
and Configuration Bits
Magnification of the high-impedance delay between PGC and PGD is shown in Figure 5-5.
1
1
READ PROGRAM FLASH SEQUENCE
2
0
0E <Addr[21:16]>
0E <Addr[15:8]>
0E <Addr[7:0]>
Data Payload
3
TABLE READ POST-INCREMENT INSTRUCTION TIMING DIAGRAM (1001)
0
4
6E F8
6E F7
6E F6
00 00
1
P5
PGD = Input
1
2
3
MOVLW Addr[21:16]
MOVWF TBLPTRU
MOVLW <Addr[15:8]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
TBLRD *+
4
Advance Information
5
6
7
8
P6
The 4-bit command is shifted in LSb first. The read is
executed during the next 8 clocks, then shifted out on
PGD during the last 8 clocks, LSb to MSb. A delay of
P6 must be introduced after the falling edge of the 8th
PGC of the operand to allow PGD to transition from an
input to an output. During this time, PGC must be held
low (see Figure 5-1). This operation also increments
the Table Pointer by one, pointing to the next byte in
program Flash for the next read.
This technique will work to read any memory in the
000000h to 3FFFFFh address space, so it also applies
to the reading of the ID and Configuration registers.
9
LSb
P14
10
1
Core Instruction
11
2
PGD = Output
12
Shift Data Out
3
13
4
14
5
15
© 2009 Microchip Technology Inc.
6
16
MSb
P5A
(Note 1)
Fetch Next 4-bit Command
1
PGD = Input
n
2
n
3
n
4
n