PIC18LF13K50-I/MQ Microchip Technology, PIC18LF13K50-I/MQ Datasheet - Page 379

• Manufacturer Part Number: PIC18LF13K50-I/MQ
• Description: IC PIC MCU FLASH 512KX8 20-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF13K50-I/MQ

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 20-QFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 14
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: EUSART/I2C/MSSP/SPI/USB
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Controller Family/series: PIC18
• No. Of I/o's: 15
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 48MHz
• No. Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

27.6
 2010 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
Thermal Considerations
P
INTERNAL
T
P
TBD = To Be Determined
I
T
T
Sym
P
DD
JMAX


PD
A
J
DER
JC
I
JA
/
= Ambient Temperature
= Junction Temperature
O
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
108.1
TBD
62.4
85.2
31.4
Typ
150
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
PIC18F/LF1XK50
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
PD = P
P
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
DS41350D-page 379
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))