PIC16F716-I/SO Microchip Technology, PIC16F716-I/SO Datasheet - Page 23

• Manufacturer Part Number: PIC16F716-I/SO
• Description: IC PIC MCU FLASH 2KX14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F716-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 13
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 8-bit
• Package: 18SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716AC164010 - MODULE SKT PROMATEII DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.5.3.8
1.5.3.9
1.5.3.10
1.5.3.11
1.5.3.12
1997 Microchip Technology Inc.
ROM Devices
DIE
Specialized Services
Quick Turn Production (QTP) Programming
Serialized Quick Turn Production (SQTP
ROM devices have their program memory fixed at the time of the silicon manufacture. Since the
program memory cannot be changed, the device can be housed in the lower cost plastic pack-
age.
The DIE option allows the board size to become as small as physically possible. The DIE Support
document (DS30258) explains general information about using and designing with DIE. There
are also individual specification sheets that detail DIE specific information. Manufacturing with
DIE requires special knowledge and equipment. This means that the number of manufacturing
houses that support DIE will be limited. If you decide to use the DIE option, please research your
manufacturing sites to ensure that they will be able to meet the specialized requirements of DIE
use.
For OTP customers with established code, Microchip offers two specialized services. These two
services, Quick Turn Production Programming and Serialized Quick Turn Production Program-
ming, that allow customers to shorten their manufacturing cycle time.
Microchip offers this programming service for factory production orders. This service is made
available for users who choose not to program a medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to the OTP devices but with all EPROM loca-
tions and configuration options already programmed by the factory. Certain code and prototype
verification procedures apply before production shipments are available. Please contact your
local Microchip sales office for more details.
Microchip offers a this unique programming service where a few user-defined locations in each
device are programmed with different serial numbers. The serial numbers may be random,
pseudo-random or sequential.
Serial programming allows each device to have a unique number which can serve as an
entry-code, password or ID number.
SM
) Programming
Section 1. Introduction
DS31001A-page 1-11
1