PESD5V0V4UF,115 NXP Semiconductors, PESD5V0V4UF,115 Datasheet - Page 11

• Manufacturer Part Number: PESD5V0V4UF,115
• Description: DIODE ESD PROTECT VLOW 6-XSON
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PESD5V0V4UF,115

• Package / Case: 6-XSON (Micropak™), SOT-886
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6.4V
• Power (watts): 16W
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Channels: 4 Channels
• Clamping Voltage: 13 V
• Operating Voltage: 5 V
• Breakdown Voltage: 6.8 V
• Peak Surge Current: 1.5 A
• Peak Pulse Power Dissipation: 16 W
• Capacitance: 12 pF
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.05(Max) mm W x 1.5(Max) mm L
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4804-2; 934061202115; PESD5V0V4UF T/R; PESD5V0V4UF T/R; PESD5V0V4UF,115

NXP Semiconductors
9. Packing information
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
[4]
10. Soldering
PESDXV4UF_G_W_3
Product data sheet
Type number
PESD3V3V4UF
PESD5V0V4UF
PESD3V3V4UG
PESD5V0V4UG
PESD3V3V4UW SOT665
PESD5V0V4UW SOT665
For further information and the availability of packing methods, see
T1: normal taping
T4: 90 rotated reverse taping
T2: reverse taping
Packing methods
Package
SOT886
SOT886
SOT353
SOT353
Fig 13. Reflow soldering footprint PESDxV4UF (SOT886)
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Reflow soldering is the only recommended soldering method.
0.370
0.270
(6 )
(6 )
Rev. 03 — 28 January 2008
Very low capacitance quadruple ESD protection diode arrays
0.325
(6 )
1.250
0.675
Section
0.425
(6
[1]
13.
0.500
0.500
[2]
[3]
[2]
[3]
[2]
[4]
[2]
[4]
1.700
Packing quantity
3000
-
-
-
-
-115
-125
-115
-125
-
-
-
-
PESDxV4UF/G/W
Dimensions in mm
4000
-
-
-
-
-
-
-
-
-
-115
-
-115
solder lands
solder paste
occupied area
5000
-115
-132
-115
-132
-
-
-
-
-
-
-
-
sot886_fr
© NXP B.V. 2008. All rights reserved.
8000
-
-
-
-
-
-
-
-
-315
-
-315
-
10000
-
-
-
-
-135
-165
-135
-165
-
-
-
-
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