EVAL-ADF4156EBZ1 Analog Devices Inc, EVAL-ADF4156EBZ1 Datasheet - Page 5

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EVAL-ADF4156EBZ1

Manufacturer Part Number
EVAL-ADF4156EBZ1
Description
BOARD EVALUATION FOR ADF4156
Manufacturer
Analog Devices Inc
Datasheet

Specifications of EVAL-ADF4156EBZ1

Module/board Type
Evaluation Board
For Use With/related Products
ADF4156
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q5595826
Q5830082A
ABSOLUTE MAXIMUM RATINGS
T
unless otherwise noted.
Table 3.
Parameter
V
V
V
V
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REF
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
Maximum Junction Temperature
DD
DD
P
P
A
Industrial (B Version)
Peak Temperature
Time at Peak Temperature
to GND
to V
= 25°C, GND = AGND = DGND = 0 V, V
IN
to GND
to V
, RF
DD
DD
IN
to GND
Rating
−0.3 V to +4 V
−0.3 V to +0.3 V
−0.3 V to +5.8 V
−0.3 V to +5.8 V
−0.3 V to V
−0.3 V to V
−0.3 V to V
−40°C to +85°C
−65°C to +125°C
150°C
260°C
40 sec
150°C
DD
= AV
DD
DD
DD
DD
= DV
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. A | Page 5 of 24
DD
,
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
THERMAL IMPEDANCE
Table 4. Thermal Impedance
Package Type
TSSOP
LFCSP_VQ (Paddle Soldered)
ESD CAUTION
θ
112
30.4
JA
ADF4156
Unit
°C/W
°C/W

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