MT18VDDF12872HG-40BD1 Micron Technology Inc, MT18VDDF12872HG-40BD1 Datasheet - Page 7

• Manufacturer Part Number: MT18VDDF12872HG-40BD1
• Description: MODULE DDR SDRAM 1GB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDF12872HG-40BD1

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 200MHz
• Package / Case: 200-SODIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 557-1116

General Description
dynamic random-access, 1GB memory module orga-
nized in a x72 configuration. DDR SDRAM modules
use internally configured quad-bank DDR SDRAM
devices.
tecture to achieve high-speed operation. The double
data rate architecture is essentially a 2n-prefetch
architecture with an interface designed to transfer two
data words per clock cycle at the I/O pins. A single read
or write access for the DDR SDRAM module effectively
consists of a single 2n-bit wide, one-clock-cycle data
transfer at the internal DRAM core and two corre-
sponding n-bit wide, one-half-clock-cycle data trans-
fers at the I/O pins.
externally, along with data, for use in data capture at
the receiver. DQS is an intermittent strobe transmitted
by the DDR SDRAM during READs and by the memory
controller during WRITEs. DQS is edge-aligned with
data for READs and center-aligned with data for
WRITEs.
clock (CK and CK#); the crossing of CK going HIGH
and CK# going LOW will be referred to as the positive
edge of CK. Commands (address and control signals)
are registered at every positive edge of CK. Input data
is registered on both edges of DQS, and output data is
referenced to both edges of DQS, as well as to both
edges of CK.
are burst oriented; accesses start at a selected location
and continue for a programmed number of locations
in a programmed sequence. Accesses begin with the
registration of an ACTIVE command, which is then fol-
lowed by a READ or WRITE command. The address
bits registered coincident with the ACTIVE command
are used to select the device bank and row to be
accessed (BA0, BA1 select devices bank; A0–A12 select
device row). The address bits registered coincident
with the READ or WRITE command are used to select
the device bank and the starting device column loca-
tion for the burst access.
read or write burst lengths of 2, 4, or 8 locations. An
auto precharge function may be enabled to provide a
self-timed row precharge that is initiated at the end of
the burst access.
lined, multibank architecture of DDR SDRAM modules
allows for concurrent operation, thereby providing
pdf: 09005aef80e4880c, source: 09005aef80e487d7
DDAF18C128x72HG.fm - Rev. A 10/04 EN
The MT18VDDF12872H is a high-speed CMOS,
DDR SDRAM modules use a double data rate archi-
A bidirectional data strobe (DQS) is transmitted
DDR SDRAM modules operate from a differential
Read and write accesses to DDR SDRAM modules
DDR SDRAM modules provide for programmable
As with standard SDR SDRAM modules, the pipe-
7
high effective bandwidth by hiding row precharge and
activation time.
power-saving power-down mode. All inputs are com-
patible with the JEDEC Standard for SSTL_2. All out-
puts are SSTL_2, Class II compatible. For more
information regarding DDR SDRAM operation, refer to
the 512Mb DDR SDRAM component data sheet.
Serial Presence-Detect Operation
detect (SPD). The SPD function is implemented using
a 2,048-bit EEPROM. This nonvolatile storage device
contains 256 bytes. The first 128 bytes can be pro-
grammed by Micron to identify the module type and
various SDRAM organizations and timing parameters.
The remaining 128 bytes of storage are available for
use by the customer. System READ/WRITE operations
between the master (system logic) and the slave
EEPROM device occur via a standard I
DIMM’s SCL (clock) and SDA (data) signals, together
with SA (2:0), which provide eight unique DIMM/
EEPROM addresses. Write protect (WP) is tied to
ground on the module, permanently disabling hard-
ware write protect.
Mode Register Definition
mode of operation of DDR SDRAM devices. This defi-
nition includes the selection of a burst length, a burst
type, a CAS latency and an operating mode, as shown
in Figure 4, Mode Register Definition Diagram, on
page 8. The mode register is programmed via the
MODE REGISTER SET command (with BA0 = 0 and
BA1 = 0) and will retain the stored information until it
is programmed again or the device loses power (except
for bit A8, which is self-clearing).
contents of the memory, provided it is performed cor-
rectly. The mode register must be loaded (reloaded)
when all device banks are idle and no bursts are in
progress, and the controller must wait the specified
time before initiating the subsequent operation. Vio-
lating either of these requirements will result in
unspecified operation.
A3 specifies the type of burst (sequential or inter-
leaved), A4–A6 specify the CAS latency, and A7–A12
specify the operating mode.
An auto refresh mode is provided, along with a
DDR SDRAM modules incorporate serial presence-
The mode register is used to define the specific
Reprogramming the mode register will not alter the
Mode register bits A0–A2 specify the burst length,
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1GB (x72, ECC, DR) PC3200
200-PIN DDR SODIMM
2
©2004 Micron Technology, Inc.
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