MT18VDDF12872HG-40BD1 Micron Technology Inc, MT18VDDF12872HG-40BD1 Datasheet - Page 20

• Manufacturer Part Number: MT18VDDF12872HG-40BD1
• Description: MODULE DDR SDRAM 1GB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDF12872HG-40BD1

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 200MHz
• Package / Case: 200-SODIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 557-1116

NOTE:
pdf: 09005aef80e4880c, source: 09005aef80e487d7
DDAF18C128x72HG.fm - Rev. A 10/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across all modules.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 10: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
1GB (x72, ECC, DR) PC3200
200-PIN DDR SODIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc.