MT46V16M16P-75:F Micron Technology Inc, MT46V16M16P-75:F Datasheet - Page 15

• Manufacturer Part Number: MT46V16M16P-75:F
• Description: IC DDR SDRAM 256MBIT 66TSOP
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V16M16P-75:F

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 7.5ns
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 66-TSOP
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 750ps
• Maximum Clock Rate: 266MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: TSOP
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 185mA
• Pin Count: 66
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 9:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
256Mb_DDR_x4x8x16_D2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
60X Ø0.45
Seating
0.12 A
11 CTR
plane
60-Ball FBGA (8mm x 14mm)
1 TYP
Notes:
A
9 8
1. Package only available in Die Revision F and G.
2. All dimensions are in millimeters.
3. Topside part marking decoder can be found on Micron’s Web site.
7
6.4 CTR
8 ±0.15
3 2 1
1
A
B
C
D
E
F
G
H
J
K
L
M
0.85 ±0.1
0.8 TYP
14 ±0.15
Ball A1 ID
15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR SDRAM
0.25 MIN
1.2 MAX
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID