W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 65

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.5 16-Pin SOIC 300-mil (Package Code SF)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
SYMBOL
e
A1
A2
E1
A
C
D
E
θ
b
L
y
(2)
10.08
10.01
Min
2.36
0.10
0.33
0.18
7.39
0.38
---
---
0°
MILLIMETERS
Nom
10.31
10.31
1.27 BSC.
2.49
2.31
0.41
0.23
7.49
0.81
---
---
---
10.49
10.64
0.076
Max
2.64
0.30
0.51
0.28
7.59
1.27
---
8°
- 65 -
0.093
0.004
0.013
0.007
0.397
0.394
0.291
0.015
Min
---
---
0°
Publication Release Date: July 08, 2010
0.050 BSC.
INCHES
Nom
0.098
0.091
0.016
0.009
0.406
0.406
0.295
0.032
DETAIL A
DETAIL A
---
---
---
Max
0.104
0.012
0.020
0.011
0.413
0.419
0.299
0.050
0.003
---
8°
W25Q16BV
GAUGE PLANE
GAUGE PLANE
Revision F