W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 60

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.
13.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SEATING PLANE
SEATING PLANE
PACKAGE SPECIFICATION
Y
Y
SYMBOL
8
8
1
1
D
E
Y
A1
e
H
A
θ
b
L
c
(2)
(4)
(3)
(3)
E
b
b b b
D
D
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 60 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
INCHES
0.050 BSC
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
0.25
0.25
10°
W25Q16BV
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ