W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 56

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

12.5 AC Measurement Conditions
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
PARAMETER
Load Capacitance
Input Rise and Fall Times
Input Pulse Voltages
Input Timing Reference Voltages
Output Timing Reference Voltages
Figure 33. AC Measurement I/O Waveform
SYMBOL
T
- 56 -
O
R
V
C
IN
, T
UT
IN
L
F
MIN
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
0.5 VCC to 0.5 VCC
SPEC
MAX
30
5
W25Q16BV
UNIT
pF
ns
V
V
V