W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 20

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.2.4 Instruction Set Table 3 (ID, Security Instructions)
Release Power down /
Device ID
Manufacturer/
Device ID
Manufacturer/Device ID
by Dual I/O
Manufacture/Device ID
by Quad I/O
JEDEC ID
Read Unique ID
Notes:
1. The Device ID will repeat continuously until /CS terminates the instruction.
2. See Manufacturer and Device Identification table for Device ID information.
INSTRUCTION
NAME
(2)
BYTE 1
(CODE)
ABh
4Bh
9Fh
90h
92h
94h
A23-A0, M[7:0]
Manufacturer
(MF7-MF0)
BYTE 2
dummy
dummy
A23-A8
dummy
xxxx, (MF[7:0], ID[7:0])
A7-A0, M[7:0]
Memory Type
(ID15-ID8)
BYTE 3
dummy
dummy
dummy
- 20 -
(MF[7:0], ID[7:0], …)
(MF[7:0], ID[7:0])
(ID7-ID0)
BYTE 4
Capacity
dummy
dummy
00h
(ID7-ID0)
(MF7-MF0)
BYTE 5
W25Q16BV
dummy
(1)
(ID7-ID0)
(ID63-ID0)
BYTE 6