MAX13003EEUE+ Maxim Integrated Products, MAX13003EEUE+ Datasheet - Page 2

IC LEVEL TRANS 6CH 16-TSSOP

MAX13003EEUE+

Manufacturer Part Number
MAX13003EEUE+
Description
IC LEVEL TRANS 6CH 16-TSSOP
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX13003EEUE+

Logic Function
Translator, Bidirectional
Number Of Bits
6
Input Type
CMOS
Output Type
CMOS
Data Rate
20Mbps
Number Of Channels
1
Number Of Outputs/channel
6
Differential - Input:output
No/No
Propagation Delay (max)
15ns
Voltage - Supply
1.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-TSSOP
Supply Voltage
1.5 V ~ 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
Voltages referenced to GND.
V
V
I/O
I/O
EN .................................................................-0.3V to (V
Short-Circuit Duration I/O
Ultra-Low-Voltage Level Translators
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
ues are at T
2
V
V
Supply Current from V
(Note 3)
Supply Current from V
V
(Note 3)
V
(Note 3)
I/O Tri-State Output Leakage
Current
I/O Tri-Stated Output Leakage
Current
EN Input Leakage Current
CC
L
L
CC
CC
L
CC
..............................................................................-0.3V to +4V
VCC_
VL_
Supply Range
Shutdown Supply Current
_______________________________________________________________________________________
...........................................................................-0.3V to +4V
Supply Range
Shutdown Supply Current
= +1.5V to +3.6V, V
............................................................-0.3V to (V
.......................................................-0.3V to (V
PARAMETER
A
= +25°C.) (Notes 1, 4)
CC
L
(Note 3)
VL_
L
= +0.9V to V
, I/O
VCC_
I
SYMBOL
SHDN-VCC
to GND ..........Continuous
I
CC
QVCC
V
I
QVL
V
CC
L
, C
I/OVL
V
(Note 2)
T
T
T
T
EN = GND, T
EN = GND, T
T
T
I/O V
EN = GND
V
V
EN = GND
T
T
≤ 15pF, C
A
A
A
A
A
A
A
A
L
L
L_
CC
≤ V
= +25°C
= +85°C
= +25°C
= +85°C
= +25°C
= +85°C
< V
= +25°C
= +85°C
, I/O V
L
L
L_
CC
+ 0.3V)
+ 0.3V)
+ 0.3V)
CC
, I/O V
(Note 2)
CC_
- 0.2V, I/O
I/OVCC
A
A
CC_
,
= +25°C
= +85°C
CONDITIONS
,
≤ 50pF, T
Continuous Power Dissipation (T
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
16-Pin TSSOP (derate 9.4mW/°C at +70°C) ................755mW
16-Bump UCSP (derate 8.2mW/°C at +70°C) .............659mW
(Note 3)
V
(Note 3)
V
V
EN = GND
EN = GND
V
EN = GND
EN = GND
T
T
T
T
A
A
A
A
L
L
L
L
< V
< V
< V
< V
= +25°C
= +85°C
= +25°C
= +85°C
A
= -40°C to +85°C, unless otherwise noted. Typical val-
CC
CC
CC
CC
- 0.2V
- 0.2V
- 0.2V,
- 0.2V,
MIN
0.9
1.5
A
= +70°C)
TYP
1
4
1
MAX
V
0.35
0.35
3.6
0.2
0.5
40
40
20
20
20
40
CC
4
5
2
2
2
4
1
1
UNITS
µA
µA
µA
µA
µA
µA
µA
V
V

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