MAX11060GUU+T Maxim Integrated, MAX11060GUU+T Datasheet - Page 2

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MAX11060GUU+T

Manufacturer Part Number
MAX11060GUU+T
Description
Analog to Digital Converters - ADC 24/16Bit 4Ch Precision ADC
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX11060GUU+T

Rohs
yes
Number Of Channels
4
Architecture
SAR
Input Type
Single-Ended/Pseudo-Differential
Interface Type
QSPI, Serial (SPI, Microwire)
Operating Supply Voltage
2.7 V to 3.6 V, 3 V to 3.6 V
Maximum Power Dissipation
1096 mW
Number Of Converters
4
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND ........................................................-0.3V to +4V
DVDD to DGND ......................................-0.3V to (V
AGND to DGND.....................................................-0.3V to +0.3V
DIN, SCLK, CS, XIN, SYNC, DRDYIN,
DOUT, DRDYOUT, CASCOUT, CLKOUT,
FAULT, OVRFLW to DGND ...................................-0.3V to +4.0V
AIN_+ to AIN_- ......................................................-6.0V to +6.0V
AIN_ _ to AGND (V
24-/16-Bit, 4-Channel, Simultaneous-Sampling,
Cascadable, Sigma-Delta ADCs
ELECTRICAL CHARACTERISTICS
(V
C
MAX11040K/MAX11060
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
DC ACCURACY (Note 2)
Resolution
Differential Nonlinearity
Integral Nonlinearity (Note 3)
Offset Error
Gain Error
Offset-Error Drift
Gain-Error Drift
Change in Gain Error vs. f
Channel-to-Channel Gain Matching
DYNAMIC SPECIFICATIONS (62.5Hz sine-wave input, 2.17V
Signal-to-Noise Ratio
Total Harmonic Distortion
Signal-to-Noise Plus Distortion
Spurious-Free Dynamic Range
Relative Accuracy (Note 7)
REF0
AVDD
CASCIN to DGND..............................-0.3V to (V
XOUT to DGND..................................-0.3V to (V
SHDN = 0, f
= C
= +3.0V to +3.6V, V
REF1
PARAMETER
XIN CLOCK
= C
AVDD
REF2
= C
≥ 3V, V
≥ 20MHz)......................-6.0V to +6.0V
OUT
REF3
DVDD
DVDD
= 1μF to AGND, T
= +2.7V to V
≥ 2.7V, FAULTDIS = 0,
SYMBOL
SINAD
SFDR
SNR
THD
DNL
INL
AVDD
DVDD
DVDD
AVDD
A
= T
, f
(Note 6) (MAX11040K)
(Note 6) (MAX11060)
T
T
MAX11060
T
T
MAX11060
T
T
MAX11060
0.1%FS input (MAX11040K)
6.0%FS input (MAX11040K)
MAX11040K
MAX11060
24-b i t no mi ssing cod e ( M AX11040K) ;
16-b i t no mi ssing cod e ( M AX 11060)
T
T
MAX11060
(Note 4)
(Note 5)
(Note 5)
f
OUT
A
A
A
A
A
A
A
A
XIN CLOCK
MIN
+ 0.3V)
+ 0.3V)
+ 0.3V)
= +25°C and + 105°C (MAX11040K)
= + 25°C and + 105°C ( M AX 11040K)
= + 25°C and + 105°C ( M AX 11040K)
= + 25°C and + 105°C ( M AX 11040K)
= -40°C (MAX11040K)
= -40°C (MAX11040K)
= -40°C (MAX11040K)
= -40°C (MAX11040K)
= 0.25ksps to 64ksps
to T
MAX
P-P
CONDITIONS
= 24.576MHz, f
)
, unless otherwise noted. Typical values are at T
AIN_ _ to AGND (V
REFIO, REF_ to AGND............................-0.3V to (V
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (T
Operating Temperature Range .........................-40°C to +105°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
or SHDN = 1 or f
TSSOP (derated 13.7mW/°C above +70°C)..............1096mW
OUT
= 16ksps, V
AVDD
XIN CLOCK
< 3V or V
MIN
103
24
16
93
89
94
89
-1
-1
REFIO
< 20MHz) ..............-3.5V to +3.5V
A
DVDD
< 0.025
0.001
0.001
= +70°C)
TYP
94.5
-106
0.03
106
100
100
= +2.5V (external), C
0.1
0.5
98
94
1
< 2.7V or FAULTDIS = 1
A
0.004
0.006
0.005
MAX
0.25
-94
-90
= +25°C.) (Note 1)
+1
+1
Maxim Integrated
AVDD
ppm/°C
ppm/°C
UNITS
% FS
% FS
%FS
%FS
+ 0.3V)
REFIO
LSB
Bits
mV
dB
dB
dB
dB
%
=

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