MF1ICS7001 PHILIPS [NXP Semiconductors], MF1ICS7001 Datasheet - Page 5
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MF1ICS7001
Manufacturer Part Number
MF1ICS7001
Description
Standard 4Kbyte card IC sawn wafer on UV-tape addendum
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.MF1ICS7001.pdf
(7 pages)
NXP Semiconductors
7. Application information
8. References
9. Revision history
Table 4.
101731
Product data sheet
Document ID Release date
101730
101731
Modifications:
Revision history
August 2004
18 April 2007
•
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP
Semiconductors.
Legal texts have been adapted to the new company name.
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•
•
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data sheet “general wafer specification for 8” wafers on uv-tape”
data sheet “standard 4kbyte card ic mf1 ic s70 functional specification”
product qualification package “standard card ic mf1 ic s70 01”
application note “mifare‚ card ic coil design guide”
Data sheet status
Initial version
Product data sheet
Rev. 3.1 — 18 April 2007
Change notice
MF1 IC S70 01
Standard 4Kbyte card IC
© NXP B.V. 2007. All rights reserved.
Supersedes
Revision 3.0
Revision 3.1
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