MF1ICS7001 PHILIPS [NXP Semiconductors], MF1ICS7001 Datasheet - Page 2

• Manufacturer Part Number: MF1ICS7001
• Description: Standard 4Kbyte card IC sawn wafer on UV-tape addendum
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
101731
Product data sheet
1.Passivation window: 90 x 90 µm
2. Pads VSS and TESTIO are disconnected when wafer is sawn.
3.4 Passivation
3.5 Bond pads
Remark: Substrate is connected to VSS.
•
•
•
•
•
•
Type:
Material:
Thickness:
Pad size:
– LA,LB
– TESTIO
– VSS
Material:
Thickness:
Rev. 3.1 — 18 April 2007
sandwich structure
PSG / Nitride(on top)
500 nm / 600 nm
118 × 118 µm
95 × 110 µm
108 × 108 µm
Al-Cu
0.85 µm
MF1 IC S70 01
2
1
2
Standard 4Kbyte card IC
© NXP B.V. 2007. All rights reserved.
2 of 7