MF1ICS7001 PHILIPS [NXP Semiconductors], MF1ICS7001 Datasheet
MF1ICS7001
Related parts for MF1ICS7001
MF1ICS7001 Summary of contents
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... The MF1 IC S70 contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader environment, which is built according to NXP specification. This specification describes electrical, physical and dimensional properties of wafers. 2. Ordering information Table 1. Type number MF1ICS7001W/V9D 3. Mechanical specification 3.1 Wafer • Diameter: • Thickness: • ...
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NXP Semiconductors 3.4 Passivation • Type: • Material: • Thickness: 3.5 Bond pads • Pad size: – LA,LB – TESTIO – VSS • Material: • Thickness: Remark: Substrate is connected to VSS. 1.Passivation window µm 2. Pads ...
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NXP Semiconductors 4. Limiting values Table 2. In accordance with the Absolute Maximum Rating System (IEC 134) Symbol tot T stg T amb V ESD I LU [1] Stresses above one or more of the limiting values ...
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NXP Semiconductors 6. Chip orientation and bond pad locations Y (1) TESTIO ( Scribeline width ( Scribeline width (3 ) Chip step, x- length (4 ) Chip step, y- length Fig 1. Chip ...
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NXP Semiconductors 7. Application information 8. References • data sheet “general wafer specification for 8” wafers on uv-tape” • data sheet “standard 4kbyte card ic mf1 ic s70 functional specification” • product qualification package “standard card ic mf1 ic s70 ...
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NXP Semiconductors 10. Legal information 10.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 12. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .1 [1][2][3] Table 2. Limiting values . . . . . . ...