CY8C20110_0809 CYPRESS [Cypress Semiconductor], CY8C20110_0809 Datasheet - Page 15

• Manufacturer Part Number: CY8C20110_0809
• Manufacturer: CYPRESS [Cypress Semiconductor]

Ordering Information
Thermal Impedances by Package
Solder Reflow Peak Temperature
Notes
Document Number: 001-17345 Rev. *E
7. T
8. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
9. Earlier termed as QFN package.
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
CY8C20110-LDX2I
CY8C20110-SX2I
Ordering Code
16 COL
Package
16 SOIC
JA.
[9]
16 COL
Package
16 SOIC
[9]
Minimum Peak Temperature
Package Diagram
001-09116
51-85068
240 °C
240 °C
[8]
Package Type
16 COL
16 SOIC
Typical θ
[9]
79.96 °C
46 °C
Maximum Peak Temperature
JA
[7]
260 °C
260 °C
Temperature
Operating
CY8C20110
Industrial
Industrial
Page 15 of 18
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