w3e16m72s-xbx White Electronic Designs Corporation, w3e16m72s-xbx Datasheet
w3e16m72s-xbx
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w3e16m72s-xbx Summary of contents
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... Two data mask (DM) pins for masking write data Programmable IOL/IOH option Auto precharge option Auto Refresh and Self Refresh Modes Commercial, Industrial and Military Temperature Ranges Organized as 16M x 72 Weight: W3E16M72S-XBX – 3.55 grams typical * This product is subject to change without notice.. Monolithic Solution 11.9 66 22.3 TSOP ...
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... DQ72 DQ71 DQ70 V V DQ75 DQ74 DQ69 DQ68 DQ77 DQ76 DQ67 DQ66 DQ79 DQ78 DQ65 DQ64 CCQ CCQ 2 W3E16M72S-XBX V V DQ16 DQ17 DQ31 V CCQ CCQ DQ18 DQ19 DQ29 DQ30 DQ20 DQ21 DQ27 DQ28 ...
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... CLK CLK # CLK CKE CKE CS DQML DQML DQMH DQMH 4 DQSL DQSL 4 DQSH DQSH 4 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX # ...
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... The address bits registered coincident with the READ or WRITE command are used to select the February 2005 Rev. 7 W3E16M72S-XBX starting column location for the burst access. Prior to normal operation, the SDRAM must be initialized. The following sections provide detailed information covering device initialization, register defi ...
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... The programmed burst length applies to both READ and WRITE bursts. February 2005 Rev. 7 W3E16M72S-XBX BURST TYPE Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. ...
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... Violating either of these requirements could result in unspecifi ed operation. 6 W3E16M72S-XBX TABLE 1 – BURST DEFINITION Order of Accesses Within a Burst Starting Column Address ...
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... ACTIVE The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided 7 W3E16M72S-XBX FIGURE 5 – EXTENDED MODE REGISTER DEFINITION ...
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... The bank(s) will be available for a subsequent row access a specifi ed time (t issued. Except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX RAS# CAS# WE ...
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... A simple algorithm for meeting both refresh and DLL re- quirements is to apply NOPs for 200 clock cycles before applying any other command. * Self refresh available in commercial and industrial temperatures only. 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX between AC later. , because XSNR ...
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... Input Capacitance: All other input-only pins -40 to +85 °C Input/Output Capacitance: I/Os -55 to +150 °C Symbol Max Units Notes 13.7 ° C/W 1 10.3 ° C/W 1 3.9 ° 1 C/W 10 W3E16M72S-XBX CAPACITANCE (NOTE 13) Symbol C I1 Input Capacitance CA 0 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com Max Unit ...
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... CKE = LOW (23, 32, 50 (MAX RAS REF 7.8125µs (27, 50) REF Standard (11) =t (MIN White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX Symbol Min Max V 2.3 2 2.3 2.7 CCQ - ...
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... WTR DQSQ t 70.3 REFC t 35 REFC t 7.8 REFI t 3.9 REFI t 0 VTD t 75 XSNR t 200 XSRD 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX 250Mbps CL2.5 200Mbps CL2.5 200Mbps CL2 150Mbps CL2 Min Max Min Max Units -0.8 +0.8 -0.8 +0.8 ns 0.45 0.55 0.45 0. 0.45 0.55 0.45 0. ...
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... Minimum -140 -160 -180 -200 2.0 2.5 0.0 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX stabilizes. Exception: during the period REF stabilizes, CKE ≤ 0.3 x VCCQ is recognized as LOW transitions occur in the same access time windows as valid data DQSS for I measurements is the smallest multiple of t ...
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... Nominal low -50 Minimum -60 -70 -80 0.0 2.0 2.5 14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX level and the referenced CC +1.5V for a pulse width ≤ 3ns and the pulse width CCQ (MAX) HZ (MAX) will prevail over t (MAX (MAX) condition. DQSCK RPST (MIN (MAX) condition ...
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... NOM 1.27 (0.050) NOM ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES February 2005 Rev. 7 Bottom View 32.1 (1.264) MAX 219 X Ø 0.762 (0.030) NOM 19.05 (0.750) NOM 15 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX 25.1 J (0.988) H MAX ...
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... PACKAGE 219 Plastic Ball Grid Array (PBGA) DEVICE GRADE Military -55°C to +125° Industrial -40°C to +85° Commercial 0°C to +70°C February 2005 Rev. 7 ORDERING INFORMATION W 3E 16M XXX White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX ...
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... Rev 7 Changes (Pg. 1, 11, 17) 7.1 Update I Specifi cations table CC February 2005 Rev pg White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com W3E16M72S-XBX Release Date Status April 2002 Advanced September 2002 Advanced November 2002 Preliminary December 2002 Preliminary November 2003 ...