mt58l512y36d Micron Semiconductor Products, mt58l512y36d Datasheet - Page 15

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mt58l512y36d

Manufacturer Part Number
mt58l512y36d
Description
16mb 1 Meg X 18, 512k X 32/36 Pipelined, Dcd Syncburst Sram
Manufacturer
Micron Semiconductor Products
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
mt58l512y36d-7.5C
Manufacturer:
MICRON
Quantity:
12
Part Number:
mt58l512y36d-7.5C
Quantity:
16
TQFP CAPACITANCE
FBGA CAPACITANCE
TQFP THERMAL RESISTANCE
FBGA THERMAL RESISTANCE
NOTE: 1. This parameter is sampled.
16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L1MY18D_2.p65 – Rev 7/00
DESCRIPTION
Control Input Capacitance
Input/Output Capacitance (DQ)
Address Capacitance
Clock Capacitance
DESCRIPTION
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Top of Case)
DESCRIPTION
Junction to Ambient
(Airflow of 1m/s)
Junction to Case (Top)
Junction to Pins
(Bottom)
DESCRIPTION
Address/Control Input Capacitance
Output Capacitance (Q)
Clock Capacitance
Test conditions follow standard test methods
Test conditions follow standard test methods
and procedures for measuring thermal
and procedures for measuring thermal
T
impedance, per EIA/JESD51.
A
impedance, per EIA/JESD51.
= 25ºC; f = 1 MHz;
CONDITIONS
V
DD
T
CONDITIONS
A
= 3.3V
CONDITIONS
= 25ºC; f = 1 MHz
CONDITIONS
15
PIPELINED, DCD SYNCBURST SRAM
16Mb: 1 MEG x 18, 512K x 32/36
SYMBOL
Micron Technology, Inc., reserves the right to change products or specifications without notice.
C
SYMBOL
C
C
C
CK
O
A
I
C
C
C
CK
O
I
TYP
3
4
3
3
SYMBOL
TYP
2.5
2.5
SYMBOL
4
θ
θ
JA
JC
q
q
q
JA
JC
JB
MAX
3.5
3.5
4
5
MAX
3.5
3.5
5
TYP
TYP
2.8
46
40
17
9
UNITS
UNITS
pF
pF
pF
pF
©2000, Micron Technology, Inc.
pF
pF
pF
UNITS NOTES
UNITS NOTES
ºC/W
ºC/W
ºC/W
ºC/W
ºC/W
ADVANCE
NOTES
NOTES
1
1
1
1
1
1
1
1
1
1
1
1

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