mt58l512y36d Micron Semiconductor Products, mt58l512y36d Datasheet

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mt58l512y36d

Manufacturer Part Number
mt58l512y36d
Description
16mb 1 Meg X 18, 512k X 32/36 Pipelined, Dcd Syncburst Sram
Manufacturer
Micron Semiconductor Products
Datasheet

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Part Number:
mt58l512y36d-7.5C
Manufacturer:
MICRON
Quantity:
12
Part Number:
mt58l512y36d-7.5C
Quantity:
16
16Mb SYNCBURST
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V ±0.165Vor 2.5V ±0.125V power supply
• Separate +3.3V or 2.5V isolated output buffer
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
• Three chip enables for simple depth expansion and
• Clock-controlled and registered addresses, data I/Os
• Internally self-timed WRITE cycle
• Burst control (interleaved or linear burst)
• Automatic power-down
• 100-pin TQFP package
• 165-pin FBGA package
• Low capacitive bus loading
• x18, x32, and x36 versions available
OPTIONS
• Timing (Access/Cycle/MHz)
• Configurations
• Packages
• Operating Temperature Range
*See page 34 for FBGA package marking guide.
16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L1MY18D_2.p65 – Rev 7/00
(V
supply (V
WRITE
address pipelining
and control signals
3.5ns/6ns/166 MHz
4.0ns/7.5ns/133 MHz
5ns/10ns/100 MHz
3.3V V
2.5V V
100-pin TQFP (3-chip enable)
165-pin FBGA
Commercial (0ºC to +70ºC)
1 Meg x 18
1 Meg x 18
DD
512K x 32
512K x 36
512K x 32
512K x 36
)
DD
DD
, 3.3V or 2.5V I/O
, 2.5V I/O
DD
Q)
MT58L1MY18DT-7.5
Part Number Example:
TQFP MARKING*
MT58V512V32D
MT58V512V36D
MT58L512Y32D
MT58L512Y36D
MT58V1MV18D
MT58L1MY18D
None
-7.5
-10
-6
T
F
PIPELINED, DCD SYNCBURST SRAM
1
MT58L1MY18D, MT58V1MV18D,
MT58L512Y32D, MT58V512V32D,
MT58L512Y36D, MT58V512V36D
3.3V V
I/O, Pipelined, Double-Cycle Deselect
GENERAL DESCRIPTION
speed, low-power CMOS designs that are fabricated
using an advanced CMOS process.
18, 512K x 32, or 512K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single-clock in-
put (CLK). The synchronous inputs include all addresses,
all data inputs, active LOW chip enable (CE#), two
additional chip enables for easy depth expansion (CE2,
CE2#), burst control inputs (ADSC#, ADSP#, ADV#),
byte write enables (BWx#) and global write (GW#). Note
that CE2# is not available on the T Version.
(OE#), clock (CLK) and snooze enable (ZZ). There is also
16Mb: 1 MEG x 18, 512K x 32/36
NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).
The Micron
Micron’s 16Mb SyncBurst SRAMs integrate a 1 Meg x
Asynchronous inputs include the output enable
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
, 3.3V or 2.5V I/O; 2.5V V
(Preliminary Package Data)
®
SyncBurst
100-Pin TQFP
165-Pin FBGA
SRAM family employs high-
1
©2000, Micron Technology, Inc.
DD
ADVANCE
, 2.5V

Related parts for mt58l512y36d

mt58l512y36d Summary of contents

Page 1

... Part Number Example: MT58L1MY18DT-7.5 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM ™ MT58L1MY18D, MT58V1MV18D, MT58L512Y32D, MT58V512V32D, MT58L512Y36D, MT58V512V36D 3.3V V I/O, Pipelined, Double-Cycle Deselect -6 -7.5 -10 NOTE: 1. JEDEC-standard MS-026 BHA (LQFP). MT58L1MY18D GENERAL DESCRIPTION ...

Page 2

... CE2# OE# NOTE: Functional block diagrams illustrate simplified device operation. See truth table, pin descriptions and timing diagrams for detailed information. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM FUNCTIONAL BLOCK DIAGRAM ...

Page 3

... NC DQd 50 NOTE Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM controls DQds and DQPd. GW# LOW causes all bytes to be written ...

Page 4

... NOTE Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 ...

Page 5

... ADV# 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM TYPE S A0 Input Synchronous Address Inputs: These inputs are registered and must S A1 meet the setup and hold times around the rising edge of CLK. ...

Page 6

... JEDEC-standard term for MODE. DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is associated with Output DQa pins; Byte “b” is associated with DQb pins. For the x32 and x36 versions, Byte “a” is associated with DQa pins; Byte “b” is DQb associated with DQb pins ...

Page 7

... SA0 DNU (LBO#) TOP VIEW *No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM PIN LAYOUT (TOP VIEW) 165-PIN FBGA ...

Page 8

... CE2# 11H 11H OE#(G#) 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM TYPE SA0 Input Synchronous Address Inputs: These inputs are registered and must SA1 meet the setup and hold times around the rising edge of CLK. ...

Page 9

... Do not alter input state while device is operating. DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is associated DQas; Output Byte “b” is associated with DQbs. For the x32 and x36 versions, Byte “a” is associated with DQas; Byte “b” is associated with DQbs; ...

Page 10

... Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM TYPE Q Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and DD Operating Conditions for range ...

Page 11

... WRITE Byte “ a ” WRITE All Bytes WRITE All Bytes NOTE: Using BWE# and BWa# through BWd#, any one or more bytes may be written. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM THIRD ADDRESS (INTERNAL) X ...

Page 12

... ADSP# LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more byte write enable signals and BWE# LOW or GW# LOW for the subsequent L-H edge of CLK. Refer to WRITE timing diagram for clarification. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 ...

Page 13

... OL curves are available upon request should never exceed V DD 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM *Stresses greater than those listed under “Absolute Maxi- mum Ratings” may cause permanent damage to the device ...

Page 14

... MODE has an internal pull-up, and input leakage = ±10µA. 4. The load used for values. AC I/O curves are available upon request. 5. This parameter is sampled. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM Q = +2.5V ±0.125V unless otherwise noted) DD CONDITIONS ...

Page 15

... Junction to Ambient Test conditions follow standard test methods (Airflow of 1m/s) Junction to Case (Top) Junction to Pins (Bottom) NOTE: 1. This parameter is sampled. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM CONDITIONS SYMBOL T = 25º MHz; ...

Page 16

... Typical values are measured at 3.3V, 25ºC, and 10ns cycle time. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM £ ...

Page 17

... This parameter is measured with the output loading shown in Figure 2. 4. This parameter is sampled. 5. Transition is measured ±500mV from steady state voltage. 6. Refer to Technical Note TN-58-09, “Synchronous SRAM Bus Contention Design Considerations,” for a more thorough discussion on these parameters “Don’t Care” when a byte write enable is sampled LOW. ...

Page 18

... SyncBurst SRAM timing is dependent upon the capaci- tive loading on the outputs. Consult the factory for copies of I/O current versus voltage curves. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM 3.3V I/O Output Load Equivalents = (V /2 ...

Page 19

... I SUPPLY I ISB2Z ALL INPUTS (except ZZ) Outputs (Q) 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM asynchronous, active HIGH input that causes the device to enter SNOOZE MODE. When ZZ becomes a logic HIGH met ...

Page 20

... Timing is shown assuming that the device was not enabled before entering into this sequence. OE# does not cause driven until after the following clock rising edge. 4. Outputs are disabled within two clock cycles after deselect. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 ...

Page 21

... Full-width WRITE can be initiated by GW# LOW GW# HIGH, BWE# LOW and BWa#-BWb# LOW for x18 device; or GW# HIGH, BWE# LOW and BWa#-BWd# LOW for x32 and x36 devices. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 ...

Page 22

... The data bus (Q) remains in High-Z following a WRITE cycle unless an ADSP#, ADSC# or ADV# cycle is performed. 4. GW# is HIGH. 5. Back-to-back READs may be controlled by either ADSP# or ADSC#. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM ...

Page 23

... NOTE: The 0/1 next to each state represents the value of TMS at the rising edge of TCK. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM TEST ACCESS PORT (TAP) TEST CLOCK (TCK) The test clock is used only with the TAP controller ...

Page 24

... DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the I/O ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the 0 Bypass Register 2 1 ...

Page 25

... PRELOAD instruction has been loaded. There is one difference between the two instructions. Unlike the SAMPLE/PRELOAD instruction, EXTEST places the SRAM outputs in a High-Z state. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM ...

Page 26

... CS and CH refer to the setup and hold time requirements of latching data from the boundary scan register. 2. Test conditions are specified using the load in Figure 7. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM ...

Page 27

... V Power-up During normal operation pulse widths less than KHKL (MIN) or operate at frequencies exceeding 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM to 2. £ +2.6V unless otherwise noted) CONDITIONS ...

Page 28

... Do Not Use: This instruction is reserved for future use. Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does not affect SRAM operation. This instruction does not implement 1149.1 preload function and is therefore not 1149.1-compliant. Do Not Use: This instruction is reserved for future use. ...

Page 29

... DQPa ADV# 22 ADSP 23 ADSC# 24 OE# (G#) 25 BWE# 26 GW# 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM PIN ID FBGA BIT# TBD 27 TBD 28 TBD 29 TBD 30 TBD 31 TBD 32 TBD 33 TBD ...

Page 30

... NC/DQPb ADV# 30 ADSP# 31 ADSC# 32 OE# (G#) 33 BWE# 34 GW# 35 CLK 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM PIN ID FBGA BIT# TBD 36 TBD 37 TBD 38 TBD 39 TBD 40 TBD 41 TBD 42 TBD ...

Page 31

... QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, IDT, and ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 ...

Page 32

... NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM ...

Page 33

... S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 SyncBurst is a trademark and Micron is a registered trademark of Micron Technology, Inc. 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 ...

Page 34

... Added note: ZZ has internal pull-down Updated Boundary Scan Order, Rev. 3/00, ADVANCE ..................................................................................... Apr/6/00 Added ADVANCE status, Rev. 1/00, ADVANCE .............................................................................................. Jan/18/00 MT58L1MY18D, Rev. 11/99, ADVANCE........................................................................................................ Nov/11/99 Added BGA JTAG functionality 16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM MT58L1MY18D_2.p65 – Rev 7/00 16Mb: 1 MEG x 18, 512K x 32/36 PIPELINED, DCD SYNCBURST SRAM 34 Micron Technology, Inc ...

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