p89lpc932ba NXP Semiconductors, p89lpc932ba Datasheet - Page 58

• Manufacturer Part Number: p89lpc932ba
• Description: P89lpc932 8-bit Microcontroller With Accelerated Two-clock 80c51 Core 8 Kb Flash With 512-byte Data Eeprom And 768-byte Ram
• Manufacturer: NXP Semiconductors

Philips Semiconductors
15. Revision history
Table 13:
9397 750 12379
Product data
Rev Date
04
03
02
20040106
20031007
20030725
Revision history
CPCN
-
-
-
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 12379); ECN 853-2433 01-A15016 dated 16 December 2003
Modifications:
Product data (9397 750 12119); ECN 853-2433 30392 dated 30 September 2003
Product data (9397 750 11712); ECN 853-2433 30141 dated 23 July 2003.
Supersedes Preliminary data P89LPC932_1 of 21 October 2002 (9397 750 10475)
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•
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Table 4 “Special function
Section 8.27.2 “Features” on page
Table 8 “DC electrical characteristics” on page
Rev. 04 — 06 January 2004
8-bit microcontroller with accelerated two-clock 80C51 core
registers”: changed PLEEN to PLLEN.
41: adjusted bullet for erase/program cycles
45: adjusted value for I
10 C measured in the atmosphere of the reflow
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
P89LPC932
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